Inventor
Tetsuya Nitta
Inventor
Kanagawa, JP
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices37%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01LSemiconductor devices13%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling4%
H10BElectronic memory devices4%
Y10TTechnical subjects covered by former us classification4%
F16CShafts1%
G08BSignalling systems, e.g. personal calling systems1%
H04NPictorial communication, e.g. television1%
PatentTitleYear
10,986,394Camera system202110,249,708Semiconductor device201910,128,359Semiconductor device with improved short circuit capability20189,972,679Semiconductor device2018RE046773Semiconductor device and method for manufacturing the same20189,881,868'Semiconductor device'20189,806,147'Semiconductor device'20179,786,594'Semiconductor device'20179,583,604'Semiconductor device with improved short circuit capability'20179,356,135'Semiconductor device and method of manufacturing the same'20169,153,673'Semiconductor device'20158,710,619'Semiconductor device and manufacturing method thereof'20148,704,330'Semiconductor device'20148,692,352'Semiconductor device and method for manufacturing the same'20148,581,299'Semiconductor device'20138,569,839'Semiconductor device and manufacturing method thereof'20138,357,989'Semiconductor device and method for manufacturing the same'20138,344,458'Semiconductor device'20138,030,730'Semiconductor device and manufacturing method thereof'20117,942,080'Index table assembly'20117,541,248'Integrated semiconductor device and method of manufacturing thereof'20097,530,293'Index table assembly'20097,418,889'Index table assembly'20087,339,236'Semiconductor device, driver circuit and manufacturing method of semiconductor device'20087,186,623'Integrated semiconductor device and method of manufacturing thereof'20077,105,387'Semiconductor device and manufacturing method for the same'20066,949,798'Semiconductor device'20056,821,824'Semiconductor device and method of manufacturing the same'20046,518,144'Semiconductor device having trenches and process for same'20036,307,246'Semiconductor resurf devices formed by oblique trench implantation'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2006Patents assigned to MITSUBISHI ELECTRIC CORP (5)· patent assignee history
2001–2011Based in Hyogo, JP· patent location history
2007–2009Patents assigned to RENESAS TECH CORP (3)· patent assignee history
2008–2021Based in Tokyo, JP· patent location history
2008–2011Based in Kanazawa, JP· patent location history
2011–2019Patents assigned to RENESAS ELECTRONICS CORP (17)· patent assignee history
2013–2015Patents assigned to NITTA TETSUYA (7)· patent assignee history
2013Patents assigned to ONISHI KAZUMA (3)· patent assignee history
2013–2018Based in Kanagawa, JP· patent location history
2015–2019Based in Kawasaki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 17 | 2011–2019 |
| NITTA TETSUYAself | 7 | 2013–2015 |
| MITSUBISHI ELECTRIC CORP | 5 | 2001–2006 |
| ONISHI KAZUMA | 3 | 2013 |
| RENESAS TECH CORP | 3 | 2007–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 9 | 2013–2018 |
| Hyogo, JP | 8 | 2001–2011 |
| Kawasaki, JP | 6 | 2015–2019 |
| Tokyo, JP | 4 | 2008–2021 |
| Kanazawa, JP | 3 | 2008–2011 |