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Inventor

Sun Hee Hong

Inventor
Hillsborough, NJ, US

Overview

3→
Patents
2004–2021
Patent span
Chemistry
Primary field (CPC C)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
C03CChemical composition of glasses, glazes or vitreous enamels11%
C08JWorking-up11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients11%
C08LCompositions of macromolecular compounds11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
10,934,401Basalt-fiber-reinforced thermoplastic composite material and method of manufacturing the same20217,037,399'Underfill encapsulant for wafer packaging and method for its application'20066,833,629'Dual cure B-stageable underfill for wafer level'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2006Patents assigned to NAT STARCH CHEM INVEST (2)· patent assignee history
2004–2006Based in Hillsborough, NJ, US· patent location history
2021Patents assigned to HYUNDAI MOTOR CO LTD (1)· patent assignee history
2021Patents assigned to KIA MOTORS CORP (1)· patent assignee history
2021Patents assigned to KOREA ADVANCED INST SCI & TECH (1)· patent assignee history
2021Based in Daejeon, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NAT STARCH CHEM INVEST22004–2006
HYUNDAI MOTOR CO LTD12021
KIA MOTORS CORP12021
KOREA ADVANCED INST SCI & TECH12021
Locations
LocationPatentsSpan
Hillsborough, New Jersey, US22004–2006
Daejeon, KR12021