Inventor
Liu Hao
Inventor
Singapore, SG
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
G06FElectric digital data processing29%
LOC1429%
PatentTitleYear
9,632,917'Software testing'20177,883,938'Stacked die semiconductor package and method of assembly'20117,824,960'Method of assembling a silicon stack semiconductor package'20107,471,827'Automatic browsing path generation to present image areas with high attention value as a function of space and time'20086,921,974'Packaged device with thermal enhancement and method of packaging'2005D0499399'Combined hands free phone device and ear piece'2004D0478578'Mobile telephone accessory'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Patents assigned to LUAU INVESTMENTS LLC (1)· patent assignee history
2003–2004Based in Zhongshan, CN· patent location history
2004Patents assigned to OVERBREAK LLC (1)· patent assignee history
2005–2010Patents assigned to UNITED TEST & ASSEMBLY CT LTD (2)· patent assignee history
2005–2011Based in Singapore, SG· patent location history
2008Patents assigned to MICROSOFT CORP (1)· patent assignee history
2008Based in Hong Kong, CN· patent location history
2017Patents assigned to IBM (1)· patent assignee history
2017Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED TEST & ASSEMBLY CT LTD | 2 | 2005–2010 |
| IBM | 1 | 2017 |
| LUAU INVESTMENTS LLC | 1 | 2003 |
| MICROSOFT CORP | 1 | 2008 |
| OVERBREAK LLC | 1 | 2004 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 3 | 2005–2011 |
| Zhongshan, CN | 2 | 2003–2004 |
| Beijing, CN | 1 | 2017 |
| Hong Kong, CN | 1 | 2008 |