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Inventor

Hyouk Lee

Inventor
Cheonan-si, KR

Overview

4→
Patents
2000–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices23%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
G04GElectronic time-pieces8%
G06FElectric digital data processing8%
G06KGraphical data reading8%
H01RElectrically-conductive connections8%
H02JElectric power networks8%
H04WWireless communication networks8%
LOC148%
PatentTitleYear
10,522,522Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same201910,474,192Wearable smart device having flexible semiconductor package mounted on a band20199,559,080'Integrated circuit device packages and methods for manufacturing integrated circuit device packages'2017D0419976'Monitor'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000Patents assigned to DAEWOO ELECTRONICS CO LTD (1)· patent assignee history
2000–2017Based in Seoul, KR· patent location history
2017–2019Patents assigned to LEE HYOUK (3)· patent assignee history
2019Patents assigned to JEONG JUN HEE (2)· patent assignee history
2019Patents assigned to SONG KI HONG (2)· patent assignee history
2019Patents assigned to SONG YOUNG HEE (2)· patent assignee history
2019Based in Cheonan-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LEE HYOUKself32017–2019
JEONG JUN HEE22019
SONG KI HONG22019
SONG YOUNG HEE22019
DAEWOO ELECTRONICS CO LTD12000
Locations
LocationPatentsSpan
Cheonan-si, KR22019
Seoul, KR22000–2017