Inventor

OWEN R. FAY

Inventor

US

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 54 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%

H01LSemiconductor devices31%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%

H01QAntennas, i.e. radio aerials11%

H10BElectronic memory devices5%

H05KPrinted circuits3%

H01HElectric switches1%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy1%

H04BTransmission1%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution1%

PatentTitleYear

12,543,610Microelectronic device assemblies, stacked semiconductor die assemblies, and memory device packages2026 12,506,118Perpendicular semiconductor device assemblies and associated methods2025 12,494,444Semiconductor device with tunable antenna using wire bonds2025 12,400,877Semiconductor devices with flexible reinforcement structure2025 12,394,750Semiconductor assemblies with redistribution structures for die stack signal routing2025 12,272,870Tunable integrated millimeter wave antenna using laser ablation and/or fuses2025 12,218,101Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same2025 12,218,119Stacked interposer structures2025 12,199,001Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same2025 12,199,068Methods of forming microelectronic device assemblies and packages2025 12,191,162Semiconductor device assembly with pillar array2025 12,170,275Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer2024 12,148,711Semiconductor packages and associated methods with antennas and EMI isolation shields2024 12,062,607Low cost three-dimensional stacking semiconductor assemblies2024 12,051,670Use of pre-channeled materials for anisotropic conductors2024 12,033,929Package-on-package semiconductor assemblies and methods of manufacturing the same2024 12,027,498Three-dimensional stacking semiconductor assemblies with near zero bond line thickness2024 11,990,446Semiconductor assemblies with redistribution structures for die stack signal routing2024 11,990,350Semiconductor devices with flexible reinforcement structure2024 11,973,062High density pillar interconnect conversion with stack to substrate connection2024 11,961,825Microelectronic device assemblies and packages including multiple device stacks and related methods2024 11,948,921Methods of forming stacked semiconductors die assemblies2024 11,908,814Fabricated two-sided millimeter wave antenna using through-silicon-vias2024 11,848,299Edge-notched substrate packaging and associated systems and methods2023 11,791,315Semiconductor assemblies including thermal circuits and methods of manufacturing the same2023 11,791,252Package-on-package semiconductor assemblies and methods of manufacturing the same2023 11,735,549Methods and systems for manufacturing pillar structures on semiconductor devices2023 11,710,888Millimeter wave antenna and EMI shielding integrated with fan-out package2023 11,664,291Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same2023 11,652,283Integrated antenna using through silicon vias2023 11,631,644High density pillar interconnect conversion with stack to substrate connection2023 11,587,912High density pillar interconnect conversion with stack to substrate connection2023 11,588,233Tunable integrated millimeter wave antenna using laser ablation and/or fuses2023 11,574,820Semiconductor devices with flexible reinforcement structure2023 11,552,045Semiconductor assemblies with redistribution structures for die stack signal routing2023 11,482,504Edge-notched substrate packaging and associated systems and methods2022 11,476,241Interposer, microelectronic device assembly including same and methods of fabrication2022 11,462,472Low cost three-dimensional stacking semiconductor assemblies2022 11,456,284Microelectronic device assemblies and packages and related methods2022 11,444,067Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems2022 11,410,973Microelectronic device assemblies and packages and related methods and systems2022 11,410,981Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer2022 11,398,465Proximity coupling interconnect packaging systems and methods2022 11,393,791Three-dimensional stacking semiconductor assemblies with near zero bond line thickness2022 11,393,794Microelectronic device assemblies and packages including surface mount components2022 11,362,070Microelectronic device assemblies and packages including multiple device stacks and related methods2022 11,309,285Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same2022 11,276,658Devices with three-dimensional structures and support elements to increase adhesion to substrates2022 11,251,516Semiconductor device with tunable antenna using wire bonds2022 11,239,129Package cooling by coil cavity2022 11,196,142Millimeter wave antenna and EMI shielding integrated with fan-out package2021 11,177,222Semiconductor packages and associated methods with antennas and EMI isolation shields2021 11,139,262Use of pre-channeled materials for anisotropic conductors2021 11,139,229Package-on-package semiconductor assemblies and methods of manufacturing the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to MICRON TECHNOLOGY INC (51)· patent assignee history

2021–2026Based in US· patent location history

2024–2026Patents assigned to LODESTAR LICENSING GROUP LLC (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	51	2021–2025
LODESTAR LICENSING GROUP LLC	3	2024–2026

Locations

Location	Patents	Span
US	54	2021–2026