Inventor
Yoshinori Kakinuma
Inventor
JP
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
B29CShaping or joining of plastics7%
B23KSoldering or unsoldering5%
B28DWorking stone or stone-like materials3%
Y10TTechnical subjects covered by former us classification3%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors2%
PatentTitleYear
12,598,953Protective member forming apparatus and method of forming protective member202612,451,388Dividing method of workpiece202512,421,362Resin sheet, manufacturing method of resin sheet, and resin covering method202512,417,938Processing apparatus for integrating a semiconductor wafer and an annular frame through a tape202512,365,162Resin sheet202512,322,638Processing apparatus202512,308,262Processing apparatus202512,308,276Tape pressure bonding apparatus202512,293,931Tape roll and tape mounter202512,230,520Protective component forming apparatus202512,220,840Sheet sticking apparatus202512,211,723Alignment device and alignment method202512,211,732Method of transferring wafer202512,122,135Sheet peeling method and sheet peeling apparatus using peeling tool202412,094,742Processing apparatus202411,942,346Resin applying machine202411,942,339Sheet attaching apparatus202411,935,778Holding mechanism including Bernoulli pad202411,935,768Device and method for attaching protective tape on semiconductor wafer202411,915,963Protective member forming apparatus202411,894,248Protective member attaching apparatus and protective member attaching method202411,865,634Processing method of workpiece202411,862,505Processing apparatus202411,794,384Protective member forming apparatus202311,769,676Protective sheet sticking apparatus202311,764,085Processing apparatus202311,715,664Holding mechanism202311,651,989Wafer transferring method202311,551,947Resin coating applying apparatus and method of applying resin coating202311,488,853Apparatus for affixing sheet202211,469,120Device and method for attaching protective tape to semiconductor wafer202211,373,888Protective member forming method and protective member forming apparatus202211,342,208Processing method and resin applying machine202211,298,928Protective sheet disposing method202211,289,354Conveying mechanism202211,135,828Protective member forming apparatus2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to DISCO CORP (33)· patent assignee history
2021–2026Based in JP· patent location history
2022–2025Patents assigned to DISCO HI TEC EUROPE GMBH (3)· patent assignee history
2022–2025Patents assigned to TAKATORI CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 33 | 2021–2026 |
| DISCO HI TEC EUROPE GMBH | 3 | 2022–2025 |
| TAKATORI CORP | 3 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 36 | 2021–2026 |