Inventor
CHIA-MING HSU
Inventor
TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices23%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
G06FElectric digital data processing6%
B82YSpecific uses or applications of nanostructures4%
A43BCharacteristic features of footwear2%
A61MDevices for introducing media into, or onto, the body2%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
B29CShaping or joining of plastics2%
PatentTitleYear
12,477,807Semiconductor device and a method for fabricating the same202512,442,694Drive system thermal temperature rise test and compensation system202512,364,017Semiconductor structure, electronic device, and method of manufacturing semiconductor structure202512,321,680Integrated circuit fin structure202512,191,401Manufacturing method for semiconductor structure having a plurality of fins202512,057,506Semiconductor device and manufacturing method thereof202412,017,015Urethral catheterization system, urinary catheter conveying device thereof, and method of using the same202411,942,467Semiconductor structure, electronic device, and method of manufacturing semiconductor structure202411,916,151Semiconductor structure having fin with all around gate202411,908,749Method of metal gate formation and structures formed by the same202411,861,282Integrated circuit fin structure manufacturing method202411,738,529Shoe, environmentally friendly shoe component thereof, and method of manufacturing environmentally friendly shoe components202311,569,362Semiconductor device and a method for fabricating the same202311,568,122Integrated circuit fin layout method202311,508,627Method of metal gate formation and structures formed by the same202211,320,327Pressure sensing device and manufacturing method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (12)· patent assignee history
2022Patents assigned to MEDX TECH INC (1)· patent assignee history
2022–2025Based in TW· patent location history
2023Patents assigned to CCILU INT INC (1)· patent assignee history
2024Patents assigned to CHIU MING CHIEN (1)· patent assignee history
2025Patents assigned to UNIV NAT TAIWAN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 12 | 2022–2025 |
| CCILU INT INC | 1 | 2023 |
| CHIU MING CHIEN | 1 | 2024 |
| MEDX TECH INC | 1 | 2022 |
| UNIV NAT TAIWAN | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 16 | 2022–2025 |