Inventor

Heiko Stahl

Inventor

Reutlingen, DE

Overview

17→

Patents

2008–2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 17 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary

B81BMicrostructural devices or systems, e.g. micromechanical devices28%

B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems25%

H01LSemiconductor devices10%

G01PMeasuring linear or angular speed, acceleration, deceleration, or shock5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%

C01BNon-metallic elements3%

C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds3%

C23CCoating metallic material3%

F04BPositive-displacement machines for liquids3%

PatentTitleYear

10,775,253Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component2020 10,766,778Polycrystalline material having low mechanical strain; method for producing a polycrystalline material2020 10,643,896Method for producing at least one via in a wafer2020 10,336,610Method for producing a micromechanical component2019 9,725,300'Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes'2017 9,667,419'System and method for cryptographic key identification'2017 9,650,240'Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type'2017 9,428,378'Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component'2016 9,206,034'Micromechanical component having a bond joint'2015 8,563,344'Method for producing MEMS structures, and MEMS structure'2013 8,492,188'Method for producing a micromechanical component'2013 8,402,827'Sensor element and method for operating a sensor element'2013 8,393,215'Micromechanical acceleration sensor having an open seismic mass'2013 8,174,082'Micromechanical component having multiple caverns, and manufacturing method'2012 7,863,072'Micromechanical diaphragm sensor having a double diaphragm'2011 7,740,459'Micropump having a pump diaphragm and a polysilicon layer'2010 7,436,076'Micromechanical component having an anodically bonded cap and a manufacturing method'2008

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2020Patents assigned to BOSCH GMBH ROBERT (17)· patent assignee history

2008–2020Based in Reutlingen, DE· patent location history

2012–2015Patents assigned to STAHL HEIKO (6)· patent assignee history

2013Patents assigned to REINMUTH JOCHEN (2)· patent assignee history

2015Patents assigned to BAER HANS-PETER (1)· patent assignee history

2015Patents assigned to DUENN CHRISTOPH (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
BOSCH GMBH ROBERT	17	2008–2020
STAHL HEIKOself	6	2012–2015
REINMUTH JOCHEN	2	2013
BAER HANS-PETER	1	2015
DUENN CHRISTOPH	1	2015

Locations

Location	Patents	Span
Reutlingen, DE	17	2008–2020