Inventor

Kenji Yamaguchi

Inventor
Tokyo, JP

Overview

82→
Patents
1982–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 82 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification7%
B23BTurning6%
C23CCoating metallic material6%
G01RMeasuring electric variables5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B24BMachines, devices, or processes for grinding or polishing5%
B29CShaping or joining of plastics4%
B23CMilling3%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
10,710,168Surface-coated cutting tool in which hard coating layer exhibits excellent chipping resistance202010,456,842Surface-coated cutting tool in which hard coating layer exhibits excellent chipping resistance201910,456,841Surface-coated cutting tool in which hard coating layers exhibits excellent chipping resistance201910,456,844Surface-coated cutting tool201910,339,977Information processing apparatus displaying indices of video contents, information processing method and information processing program201910,329,671Surface-coated cutting tool having hard coating layer that exhibits excellent chipping resistance201910,307,830Surface-coated cutting tool having hard coating layer that exhibits excellent chipping resistance201910,307,831Surface coating cutting tool201910,265,785Surface-coated cutting tool and method for producing the same201910,181,753Electric power system protection device, electric path switching device, and electric power supply system201910,166,647Polishing apparatus and polishing method201910,052,896Recording apparatus, and cleaning method of recording apparatus20189,797,040'Surface coated cutting tool'20179,782,830'Surface-coated cutting tool'20179,562,942'Probe apparatus'20179,517,544'Polishing apparatus and polishing method'20169,415,446'Surface coated cutting tool'20169,287,158'Substrate processing apparatus'20169,172,904'Information processing apparatus displaying indices of video contents, information processing method and information processing program'20158,993,749'Eriocitrin-containing material, method for production of the eriocitrin-containing material, and food, beverage, pharmaceutical preparation and cosmetic each comprising the eriocitrin-containing material'20158,986,069'Polishing apparatus and polishing method'20158,452,262'Terminal device'20138,310,514'Line head control method, image forming method, and image forming apparatus'20128,187,055'Polishing apparatus and polishing method'20128,179,415'Exposure head and image forming apparatus'20128,132,211'Information processing apparatus displaying indices of video contents, information processing method and information processing program'20128,089,136'Semiconductor device'20128,058,318'Acidic zirconia sol and production method of the same'20118,029,333'Device for polishing peripheral edge of semiconductor wafer'20117,924,303'Line head controlling method and image forming method'20117,892,343'Method for manufacturing slurry and mold for precision casting'20117,862,402'Polishing apparatus and substrate processing apparatus'20117,834,898'Image forming device, image forming method, and exposure head'20107,821,078'Semiconductor device having resistor elements and method for manufacturing the same'20107,767,472'Substrate processing method and substrate processing apparatus'20107,691,910'Acidic zirconia sol and production method of the same'20107,682,225'Polishing apparatus and substrate processing apparatus'20107,629,389'Production method of alkaline zirconia sol'20097,553,474'Method for producing metal oxide sol'20097,480,598'Characteristic evaluation apparatus for insulated gate type transistors'20097,476,290'Substrate processing apparatus and substrate processing method'20097,432,608'Generator and power supply for use therein'20087,172,717'In-mold foam molding apparatus and method, and in-mold foam molded articles'20077,138,650'Semiconductor substrate, field-effect transistor, and their manufacturing method of the same'20067,070,720'Die-expanded molding apparatus and method for synthetic resin, and die-expanded molded foam obtained thereby'20067,056,789'Production method for semiconductor substrate and production method for field effect transistor and semiconductor substrate and field effect transistor'20067,045,865'Semiconductor device with resistor elements formed on insulating film'20067,034,694'Body motion detector'20066,878,431'In-mold foam molded articles'20056,800,227'Material bead charging method, synthetic resin mold foam forming method using this method, and mold foam formed product obtained by this method'20046,779,160'Apparatus, method and pattern for evaluating semiconductor device characteristics'20046,735,558'Characteristic extraction device, characteristic evaluation device, characteristic extraction method, characteristic evaluation method, recording medium and semiconductor device'20046,727,724'Characteristic evaluation apparatus for insulated gate type transistors'20046,649,430'Characteristic evaluation apparatus for insulated gate type transistors'20036,619,943'In-mold foam molding apparatus with movable partitioning members'20036,569,534'Optical material and optical element using the same'20036,559,672'Characteristic evaluation apparatus for insulated gate type transistors'20036,558,592'Synthetic resin internal foam molding machine and method'20036,525,338'Semiconductor substrate, field effect transistor, method of forming SiGe layer and method of forming strained Si layer using same, and method of manufacturing field effect transistor'20036,518,592'Apparatus, method and pattern for evaluating semiconductor device characteristics'20036,500,368'Polyolefin synthetic resin in-mold foam molding method'20026,407,573'Device for evaluating characteristic of insulated gate transistor'20026,399,225'Silicon-and-nitrogen-containing luminescent substance, method for forming the same, and light emitting device using the same'20026,373,274'Characteristic evaluation apparatus for insulated gate type transistors'20026,169,114'Endermic liniment containing a thiol compound and zinc oxide'20016,169,415'Characteristic evaluation apparatus for insulated gate type transistors'20015,817,161'Optical element forming method'19985,799,716'Electric-powered shutter apparatus for a building opening'19985,654,739'Controller including multi-function'19975,589,668'Multi-metal layer wiring tab tape carrier and process for fabricating the same'19965,510,809'Controller including multifunctions'19965,450,473'Method and arrangement of effectively reducing signal strength measurements for a handoff in a cellular mobile communications system'19955,442,229'Metal lead-film carrier assembly having a plurality of film carriers, and film carrier-semiconductor chip assembly and semiconductor device containing such metal lead-film carrier assembly'19955,434,694'Signal isolating device'19955,428,889'Method for manufacturing composite lead frame'19955,326,990'Composite lead frame with connected inner and outer leads'19945,277,009'Exterior wall units comprising siding members and tiles'1994D0328795'Skylight'1992D0328353'Adjustable skylight'19925,115,601'Movable sky light'19924,956,795'Signal conditioners'19904,359,425'Organo-platinum complex'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–2019Based in Osaka, JP· patent location history
1990–2019Based in Tokyo, JP· patent location history
2001–2003Patents assigned to MITSUBISHI ELECTRIC CORP (6)· patent assignee history
2002–2020Patents assigned to MITSUBISHI MATERIALS CORP (14)· patent assignee history
2002–2007Patents assigned to KANEKA CORP (7)· patent assignee history
2009–2019Patents assigned to EBARA CORP (10)· patent assignee history
2009–2011Based in Sodegaura, JP· patent location history
2010–2012Based in Matsumoto, JP· patent location history
2011–2016Patents assigned to YAMAGUCHI KENJI (11)· patent assignee history
2017–2020Based in Naka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI MATERIALS CORP142002–2020
YAMAGUCHI KENJIself112011–2016
EBARA CORP102009–2019
KANEKA CORP72002–2007
MITSUBISHI ELECTRIC CORP62001–2003
Locations
LocationPatentsSpan
Tokyo, JP351990–2019
Naka, JP92017–2020
Osaka, JP91982–2019
Sodegaura, JP52009–2011
Matsumoto, JP42010–2012