Inventor
ROBERT FRANCIS DARVEAUX
Inventor
US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H01LSemiconductor devices24%
H05KPrinted circuits20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
H03FAmplifiers4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
B29CShaping or joining of plastics2%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts2%
B29LIndexing scheme associated with subclass b29c, relating to particular articles2%
G06VImage or video recognition or understanding2%
PatentTitleYear
12,593,394Heat transfer from non-groundable electronic components202612,520,415Method of transferring heat from ungrounded electronic components202612,431,445Methods related to dual-sided module with land-grid array (LGA) footprint202512,191,241Fine pitch copper pillar package and method202512,033,954Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same202412,009,343Stackable package and method202411,974,390Reduction of packaging substrate deformation202411,961,805Devices and methods related to dual-sided radio-frequency package with overmold structure202411,894,323Devices related to dual-sided module with land-grid array (LGA) footprint202411,765,814Devices and methods related to nested filters202311,596,056Methods and devices related to reduced packaging substrate deformation202311,545,405Packaging for fingerprint sensors and methods of manufacture202311,244,835Control of under-fill using a film during fabrication for a dual-sided ball grid array package202211,233,014Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same202211,201,066Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package202111,190,158Low frequency shield solutions with sputtered/sprayed absorber materials and/or absorber materials mixed in mold compound202111,139,257Methods related to dual-sided module with land-grid array (LGA) footprint2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to SKYWORKS SOLUTIONS INC (14)· patent assignee history
2021–2026Based in US· patent location history
2023–2025Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SKYWORKS SOLUTIONS INC | 14 | 2021–2026 |
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 3 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 17 | 2021–2026 |