Inventor

Masakazu Watanabe

Inventor
Nagoya, JP

Overview

59→
Patents
1982–2019
Patent span
Chemistry
Primary field (CPC C)

Patents· 59 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C04Bprimary
C04BLime, magnesia26%
Y10TTechnical subjects covered by former us classification9%
C23CCoating metallic material6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
G02BOptical elements, systems or apparatus3%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%
C08LCompositions of macromolecular compounds3%
H05KPrinted circuits3%
PatentTitleYear
10,186,498Semiconductor leadframes and packages with solder dams and related methods20199,293,555'Semiconductor device and manufacturing method of same'20168,633,511'Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material'20148,489,933'Data processing device and method for memory dump collection'20137,767,898'Display equipment and display program for electronic musical instruments'20107,650,614'Electrical device cabinet'20106,903,937'Outer casing of electric equipment'20056,863,929'Method for forming coated film and intermediate coating material'20056,827,129'Vehicle-mounted structure for heat exchanger'20046,641,195'Vehicular cockpit module assembly and assembling method'20036,615,571'Apparatus and method for assembling optical cable'20036,434,306'Optical cable and manufacturing method thereof'20026,256,868'Assembly process apparatus'20016,251,483'Recyclable cold curing aqueous coating composition and method for recycling it'20016,237,316'Optical fiber ribbon stranding method and device'20016,128,657'Load sharing system'20006,054,508'Water dispersible resin composition and process for producing the same'20005,863,606'Method for producing diamond coated member'19995,858,480'Ceramic-based substrate for coating diamond and method for preparing substrate for coating'19995,725,932'Ceramic-based substrate for coating diamond and method for preparing substrate for coating'19985,705,271'Method for producing diamond coated member'19985,626,908'Method for producing silicon nitride based member coated with film of diamond'19975,601,764'Process for making TiC-base/SiC whisker composite ceramic cutting tools'19975,439,854'TiC-base/SiC whisker composite ceramic cutting tools'19955,334,453'Diamond-coated bodies and process for preparation thereof'19945,318,836'Diamond-coated body'19945,270,392'Hydroxyl polyglycidyl ether or acrylic copolymer with anhydride copolymer'19935,151,125'Aqueous coating composition'19925,128,285'Silicon oxynitride sintered body'19925,122,486'Method of producing silicon-nitride-based sintered body'19925,114,888'Silicon nitride sintered body and method for producing same'19925,049,531'Silicon nitride sintered body'19915,045,513'Sintered body of silicon nitride and its manufacture'19915,043,452'Titanium or silicon atom containing oxazolidine compound'19915,039,343'Water borne metallic coating composition'19915,032,554'Sintered silicon nitride products'19915,028,451'Method of producing sintered hard metal with diamond film'19915,026,601'Zirconia-base sintered bodies having coating films'19915,023,298'Curable composition'19914,997,798'Process for producing aluminum nitride sintered body with high thermal conductivity'19914,961,987'Aluminum nitride sintered body with high thermal conductivity and process for producing same'19904,956,317'Whisker-reinforced ceramics'19904,946,807'Composite ceramic material reinforced with silicon carbide whiskers'19904,880,756'Silicon nitride sintered product'19894,877,760'Aluminum nitride sintered body with high thermal conductivity and process for producing same'19894,833,871'Apparatus for inserting optical fibers into a spacer having spiral grooves'19894,800,137'Composite layer aluminum nitride base sintered body'19894,760,312'Dense silicon carbide microwave absorber for electron linear accelerator'19884,748,138'Highly toughened, sintered mass of zirconia'19884,701,426'Silicon carbide-graphite composite material'19874,695,517'Composite layer aluminum nitride base sintered body'19874,690,909'Silicon carbide-graphite composite material and process for producing same'19874,668,452'Process for producing silicon carbide heating elements'19874,638,268'Microwave absorber comprised of a dense silicon carbide body which is water cooled'19874,626,517'High toughness sintered bodies'19864,626,392'Process for producing ceramic body for surgical implantation'19864,626,518'Method for manufacturing high toughness sintered bodies'19864,375,517'Sintered cubic boron nitride and process for producing the same'19834,336,216'Process for producing silicon carbide heating elements'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1982–1999Patents assigned to NGK SPARK PLUG CO (35)· patent assignee history
1982–2004Based in Nagoya, JP· patent location history
1983–1998Based in Aichi, JP· patent location history
1989–2003Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (4)· patent assignee history
1989–2003Based in Kanagawa, JP· patent location history
1991–2005Patents assigned to NIPPON PAINT CO LTD (8)· patent assignee history
1991–1994Patents assigned to IDEMITSU PETROCHEMICAL CO (3)· patent assignee history
1991–2000Based in Toyonaka, JP· patent location history
2001–2004Patents assigned to DENSO CORP (3)· patent assignee history
2014–2019Based in Ota, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NGK SPARK PLUG CO351982–1999
NIPPON PAINT CO LTD81991–2005
SUMITOMO ELECTRIC INDUSTRIES41989–2003
DENSO CORP32001–2004
IDEMITSU PETROCHEMICAL CO31991–1994
Locations
LocationPatentsSpan
Nagoya, JP261982–2004
Aichi, JP121983–1998
Toyonaka, JP61991–2000
Kanagawa, JP31989–2003
Ota, JP22014–2019