Inventor
Riet Labie
Inventor
Kessel-Lo, BE
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems29%
H01RElectrically-conductive connections14%
H05KPrinted circuits14%
PatentTitleYear
10,412,830System including a conductive textile and an electronic circuit unit and a method20197,880,315'Methods for bonding and micro-electronic devices produced according to such methods'20117,547,625'Methods for bonding and micro-electronic devices produced according to such methods'20096,908,856'Method for producing electrical through hole interconnects and devices made thereof'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2009Patents assigned to IMEC INTER UNI MICRO ELECTR (2)· patent assignee history
2005–2011Based in Kessel-Lo, BE· patent location history
2011Patents assigned to IMEC (1)· patent assignee history
2019Patents assigned to IMEC VZW (1)· patent assignee history
2019Based in Leuven, BE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IMEC INTER UNI MICRO ELECTR | 2 | 2005–2009 |
| IMEC | 1 | 2011 |
| IMEC VZW | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kessel-Lo, BE | 3 | 2005–2011 |
| Leuven, BE | 1 | 2019 |