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Inventor

Terence Cheung

Inventor
Toronto, CA

Overview

3→
Patents
2011–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H05KPrinted circuits20%
H01GCapacitors10%
H01LSemiconductor devices10%
H10DInorganic electric semiconductor devices10%
Y02PClimate change mitigation technologies in the production or processing of goods10%
Y10TTechnical subjects covered by former us classification10%
PatentTitleYear
9,209,106'Thermal management circuit board for stacked semiconductor chip device'20158,314,474'Under bump metallization for on-die capacitor'20128,012,874'Semiconductor chip substrate with multi-capacitor footprint'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2015Patents assigned to ATI TECHNOLOGIES ULC (3)· patent assignee history
2011–2012Based in Toronto, CA· patent location history
2012–2015Patents assigned to CHEUNG TERENCE (2)· patent assignee history
2012Patents assigned to CHUNG DANIEL (1)· patent assignee history
2012Patents assigned to GUO FEI (1)· patent assignee history
2015Patents assigned to ADVANCED MICRO DEVICES INC (1)· patent assignee history
2015Based in San Diego, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ATI TECHNOLOGIES ULC32011–2015
CHEUNG TERENCEself22012–2015
ADVANCED MICRO DEVICES INC12015
CHUNG DANIEL12012
GUO FEI12012
Locations
LocationPatentsSpan
Toronto, CA22011–2012
San Diego, California, US12015