Inventor
Lisa Yang
Inventor
San Jose, CA, US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10DInorganic electric semiconductor devices14%
H01JElectric discharge tubes or discharge lamps7%
LOC087%
PatentTitleYear
7,485,556'Forming metal silicide on silicon-containing features of a substrate'20097,321,140'Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier'20086,426,282'Method of forming solder bumps on a semiconductor wafer'20026,297,147'Plasma treatment for ex-situ contact fill'2001D0436815'Pivotal coupling for a shear device'20016,149,784'Sputtering chamber shield promoting reliable plasma ignition'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2009Patents assigned to APPLIED MATERIALS INC (5)· patent assignee history
2000–2002Based in San Jose, CA, US· patent location history
2001Based in Taichung, TW· patent location history
2008–2009Based in Saratoga, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 5 | 2000–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 3 | 2000–2002 |
| Saratoga, California, US | 2 | 2008–2009 |
| Taichung, TW | 1 | 2001 |