Inventor

Hisanori Matsuo

Inventor

Tokyo, JP

Overview

2001–2020

Patent span

Performing operations

Primary field (CPC B)

Patents· 42 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing49%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%

B24DTools for grinding, buffing or sharpening6%

G01BMeasuring length, thickness or similar linear dimensions5%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light5%

G01NInvestigating or analysing materials by determining their chemical or physical properties4%

H01LSemiconductor devices2%

B08BCleaning in general1%

C11DDetergent compositions1%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h101%

PatentTitleYear

10,710,208Polishing method and polishing apparatus2020 10,478,936Method and apparatus for measuring surface properties of polishing pad2019 10,414,018Apparatus and method for regulating surface temperature of polishing pad2019 10,401,285Apparatus for measuring surface properties of polishing pad2019 10,369,675CMP apparatus having polishing pad surface property measuring device2019 10,259,098Method and apparatus for polishing a substrate2019 10,195,712Polishing method and polishing apparatus2019 10,035,238Polishing method and polishing apparatus2018 9,969,046Method and apparatus for polishing a substrate2018 9,782,870'Polishing method and polishing apparatus'2017 9,669,515'Polishing apparatus'2017 9,579,768'Method and apparatus for polishing a substrate'2017 9,393,670'Measuring method of surface roughness of polishing pad'2016 9,242,339'Polishing apparatus and polishing method'2016 9,156,130'Method of adjusting profile of a polishing member used in a polishing apparatus, and polishing apparatus'2015 9,108,292'Method of obtaining a sliding distance distribution of a dresser on a polishing member, method of obtaining a sliding vector distribution of a dresser on a polishing member, and polishing apparatus'2015 9,067,296'Polishing method'2015 8,932,883'Method of measuring surface properties of polishing pad'2015 8,360,817'Polishing apparatus and polishing method'2013 8,241,426'CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device'2012 7,207,864'Polishing apparatus'2007 7,040,968'Polishing apparatus'2006 6,942,548'Polishing method using an abrading plate'2005 6,939,208'Polishing apparatus'2005 6,712,678'Polishing-product discharging device and polishing device'2004 6,672,945'Polishing apparatus and dressing method'2004 6,626,739'Polishing method and polishing apparatus'2003 6,595,831'Method for polishing workpieces using fixed abrasives'2003 6,579,148'Polishing apparatus'2003 6,520,845'Polishing apparatus'2003 6,458,012'Polishing apparatus'2002 6,413,155'Polishing apparatus'2002 6,413,149'Abrading plate and polishing method using the same'2002 6,402,588'Polishing apparatus'2002 6,398,626'Polishing apparatus'2002 6,390,901'Polishing apparatus'2002 6,336,850'Slurry dispenser and polishing apparatus'2002 6,261,162'Polishing apparatus and method of manufacturing grinding plate'2001 6,220,945'Polishing apparatus'2001 6,217,411'Polishing apparatus'2001 6,196,904'Polishing apparatus'2001 6,190,243'Polishing apparatus'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2020Patents assigned to EBARA CORP (42)· patent assignee history

2001–2003Based in Fujisawa, JP· patent location history

2001–2012Based in Kanagawa, JP· patent location history

2004–2020Based in Tokyo, JP· patent location history

2012–2017Patents assigned to MATSUO HISANORI (4)· patent assignee history

2013–2015Patents assigned to ISHII YU (2)· patent assignee history

2015–2017Patents assigned to KYUSHU INST TECHNOLOGY (2)· patent assignee history

2019Patents assigned to KYUSHU INST TECH (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
EBARA CORP	42	2001–2020
MATSUO HISANORIself	4	2012–2017
ISHII YU	2	2013–2015
KYUSHU INST TECH	2	2019
KYUSHU INST TECHNOLOGY	2	2015–2017

Locations

Location	Patents	Span
Tokyo, JP	23	2004–2020
Fujisawa, JP	13	2001–2003
Kanagawa, JP	6	2001–2012