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Inventor

Huan-Tai Lin

Inventor
New Taipei, TW

Overview

2→
Patents
2004–2021
Patent span
Mechanical engineering
Primary field (CPC F)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

F16Fprimary
F16FSprings14%
F16MFrames, casings or beds of engines, machines or apparatus, not specific to engines, machines or apparatus provided for elsewhere14%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices14%
G06FElectric digital data processing14%
H05KPrinted circuits14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
PatentTitleYear
10,966,344Mounting apparatus and heat dissipating device using the same20216,784,005'Photoresist reflow for enhanced process window for random, isolated, semi-dense, and other non-dense contacts'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
2004Based in Hsin Chu, TW· patent location history
2021Patents assigned to NANNING FUGUI PREC IND CO LTD (1)· patent assignee history
2021Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NANNING FUGUI PREC IND CO LTD12021
TAIWAN SEMICONDUCTOR MFG12004
Locations
LocationPatentsSpan
New Taipei, TW12021
Hsin Chu, TW12004