Inventor
HUI-CHI HUANG
Inventor
TW
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%
B24BMachines, devices, or processes for grinding or polishing18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10DInorganic electric semiconductor devices7%
C09GPolishing compositions5%
B08BCleaning in general4%
A46BBrushes2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
B01FMixing, e.g. dissolving, emulsifying or dispersing1%
PatentTitleYear
12,568,786Processing tool and method202612,550,652Wafer edge trimming process including water jet and wedge separation and methods thereof202612,362,201Bevel edge removal methods, tools, and systems202512,359,090Composition and method for polishing and integrated circuit202512,327,734Chemical mechanical polish slurry and method of manufacture202512,297,375Slurry composition and method for polishing and integrated circuit202512,300,508Chemical mechanical polishing method202512,249,542Semiconductor device structure with an interconnect structure in a dielectric layer with multiple hydrophobic layers along sidewalls of the dielectric layer, and method for forming the same202512,128,455Electrical cleaning tool for wafer polishing tool system202412,087,590Self-healing polishing pad202412,036,636Mega-sonic vibration assisted chemical mechanical planarization202412,030,159Chemical mechanical planarization tool202411,964,358Chemical mechanical polishing apparatus and method202411,850,704Methods to clean chemical mechanical polishing systems202311,854,827Magnetic slurry for highly efficiency CMP202311,854,872Semiconductor device structure with interconnect structure and method for forming the same202311,712,778Chemical mechanical planarization tool202311,664,213Bevel edge removal methods, tools, and systems202311,590,627Mega-sonic vibration assisted chemical mechanical planarization202311,551,936Self-healing polishing pad202311,446,785Methods to clean chemical mechanical polishing systems202211,417,566Semiconductor device structure with interconnect structure and method for forming the same202211,373,879Chemical mechanical polishing method202211,264,232Methods and systems for chemical mechanical polish cleaning202211,217,479Multiple metallization scheme202211,145,751Semiconductor structure with doped contact plug and method for forming the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (26)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 26 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 26 | 2021–2026 |