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Inventor

Dominique L. Demers

Inventor
Waterloo, CA

Overview

2→
Patents
2018–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Bprimary
G01BMeasuring length, thickness or similar linear dimensions33%
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
10,969,222Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect20219,897,444'Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect'2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018–2021Patents assigned to IBM (2)· patent assignee history
2018–2021Based in Waterloo, CA· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM22018–2021
Locations
LocationPatentsSpan
Waterloo, CA22018–2021