Inventor
Jie CHANG
Inventor
CN
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
LOC0714%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry7%
C07CAcyclic or carbocyclic compounds7%
H01RElectrically-conductive connections7%
H05KPrinted circuits7%
LOC047%
LOC147%
PatentTitleYear
12,594,545Nanostructured hybrid iron-zeolite catalysts202612,354,930Module with substrate recess for conductive-bonding component202512,119,576Press-fit power module and related methods202411,776,871Module with substrate recess for conductive-bonding component2023D0998926Lint remover2023D0998270Cleaning device component2023D0990891Lint remover2023D0989083Movable portable device holder2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023Patents assigned to CHANG JIE (4)· patent assignee history
2023–2025Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (3)· patent assignee history
2023–2025Based in CN· patent location history
2026Patents assigned to AGENCY FOR SCIENCE TECH AND RESEARCH (1)· patent assignee history
2026Patents assigned to IHI CORP (1)· patent assignee history
2026Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CHANG JIEself | 4 | 2023 |
| SEMICONDUCTOR COMPONENTS IND LLC | 3 | 2023–2025 |
| AGENCY FOR SCIENCE TECH AND RESEARCH | 1 | 2026 |
| IHI CORP | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 7 | 2023–2025 |
| SG | 1 | 2026 |