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Inventor

Takashi Imoto

Inventor
Yokohama, JP

Overview

25→
Patents
2002–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1040%
H01LSemiconductor devices14%
G06FElectric digital data processing9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H10DInorganic electric semiconductor devices7%
C09JAdhesives5%
C23CCoating metallic material5%
G02BOptical elements, systems or apparatus5%
A61BDiagnosis2%
G06KGraphical data reading2%
PatentTitleYear
10,799,156Sheet for identification202010,312,197Method of manufacturing semiconductor device and semiconductor device20199,824,905'Semiconductor manufacturing device and semiconductor manufacturing method'20179,458,535'Semiconductor manufacturing device and semiconductor manufacturing method'20169,385,090'Semiconductor device and method of manufacturing semiconductor device'20169,207,889'Information processing apparatus, information processing method, and storage medium'20159,209,053'Manufacturing method of a conductive shield layer in semiconductor device'20158,896,111'Semiconductor device and method for manufacturing the same'20148,237,295'Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device'20127,932,605'Semiconductor device and manufacturing method therefor'20117,682,692'Pressure-sensitive adhesive product'20107,608,911'Semiconductor device package having a semiconductor element with a roughened surface'20097,497,535'Print control apparatus, print control method thereof, control program, printer driver, printer, and computer readable storage medium'20097,423,772'Information processing apparatus, job processing method and program, and computer-readable memory medium'20087,405,159'Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface'20087,352,052'Semiconductor device and manufacturing method therefor'20087,298,035'Semiconductor device and a method of assembling a semiconductor device'20077,255,493'Optical semiconductor module and its manufacturing method'20077,202,563'Semiconductor device package having a semiconductor element with resin'20077,158,243'Printing apparatus and printing system, control method, storage medium and program'20077,118,294'Optical semiconductor module and its manufacturing method'20066,861,738'Laminated-chip semiconductor device'20056,734,541'Semiconductor laminated module'20046,617,678'Semiconductor device'20036,469,374'Superposed printed substrates and insulating substrates having semiconductor elements inside'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2016Patents assigned to TOSHIBA KK (17)· patent assignee history
2002–2015Based in Yokohama, JP· patent location history
2007–2015Patents assigned to CANON KK (4)· patent assignee history
2007–2012Based in Mie, JP· patent location history
2007–2008Based in Kanagawa, JP· patent location history
2010–2020Patents assigned to NITTO DENKO CORP (2)· patent assignee history
2010–2020Based in Ibaraki, JP· patent location history
2012–2015Patents assigned to IMOTO TAKASHI (2)· patent assignee history
2015–2019Based in Kamakura, JP· patent location history
2017–2019Patents assigned to TOSHIBA MEMORY CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK172002–2016
CANON KK42007–2015
IMOTO TAKASHIself22012–2015
NITTO DENKO CORP22010–2020
TOSHIBA MEMORY CORP22017–2019
Locations
LocationPatentsSpan
Yokohama, JP132002–2015
Kamakura, JP52015–2019
Ibaraki, JP22010–2020
Mie, JP22007–2012
Kanagawa, JP22007–2008