Inventor
Yasunari Suto
Inventor
Tokyo, JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing25%
G01BMeasuring length, thickness or similar linear dimensions22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
G01RMeasuring electric variables13%
G01DMeasuring not specially adapted for a specific variable9%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
H01LSemiconductor devices3%
PatentTitleYear
10,134,614Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus20187,854,646'Substrate polishing apparatus and substrate polishing method'20107,714,572'Method of detecting characteristics of films using eddy current'20107,670,206'Substrate polishing apparatus and substrate polishing method'20107,508,201'Eddy current sensor'20097,078,894'Polishing device using eddy current sensor'20067,046,001'Frequency measuring device, polishing device using the same and eddy current sensor'20066,935,935'Measuring apparatus'20056,746,319'Measuring apparatus'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2018Patents assigned to EBARA CORP (9)· patent assignee history
2004–2018Based in Tokyo, JP· patent location history
2006–2010Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 9 | 2004–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 2004–2018 |
| Kanagawa, JP | 3 | 2006–2010 |