Inventor

Evan G. Colgan

Inventor

Chestnut Ridge, NY, US

Overview

1993–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 190 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%

H05KPrinted circuits13%

Y10TTechnical subjects covered by former us classification11%

H01LSemiconductor devices7%

H01RElectrically-conductive connections7%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%

H10DInorganic electric semiconductor devices4%

G06FElectric digital data processing4%

G02BOptical elements, systems or apparatus3%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application2%

PatentTitleYear

11,103,867Localized surface modification for microfluidic applications2021 11,039,765Smart pellet for sample testing2021 11,022,559Analysis using optical sensors and signal enhancing agents2021 10,892,170Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader2021 10,727,158Counter-flow expanding channels for enhanced two-phase heat removal2020 10,727,159Counter-flow expanding channels for enhanced two-phase heat removal2020 10,605,741Accurate colorimetric based test strip reader system2020 10,607,963Chip package for two-phase cooling and assembly process thereof2020 10,596,540Flow cell array and uses thereof2020 10,583,414Flow cell array and uses thereof2020 10,566,215Method of fabricating a chip module with stiffening frame and orthogonal heat spreader2020 10,529,648Counter-flow expanding channels for enhanced two-phase heat removal2020 10,424,494Chip module with stiffening frame and orthogonal heat spreader2019 10,393,667Analysis using optical sensors and signal enhancing agents2019 10,282,646Tag with tunable retro-reflectors2019 10,258,954Flow cell array and uses thereof2019 10,249,516Underfill dispensing using funnels2019 10,232,337Flow cell array and uses thereof2019 10,169,288Node interconnect architecture to implement high-performance supercomputer2019 10,132,433Releasable, threadless conduit connector for liquid manifold2018 10,107,426Releasable, threadless conduit connector for liquid manifold2018 10,090,173Method of fabricating a chip module with stiffening frame and directional heat spreader2018 10,006,571Releasable, threadless conduit connector for liquid manifold2018 9,941,250Chip stack structures that implement two-phase cooling with radial flow2018 9,941,189Counter-flow expanding channels for enhanced two-phase heat removal2018 9,941,788Three-D power converter in three distinct strata2018 9,852,960Underfill dispensing using funnels2017 9,818,054'Tag with tunable retro-reflectors'2017 9,660,525'Three-D power converter in three distinct strata'2017 9,648,782'Chip stack structures that implement two-phase cooling with radial flow'2017 9,568,960'Supercomputer using wafer scale integration'2017 9,520,779'Three-D power converter in three distinct strata'2016 9,470,439'Contaminant separator for a vapor-compression refrigeration apparatus'2016 9,437,515'Heat spreading layer with high thermal conductivity'2016 9,418,976'Chip stack with electrically insulating walls'2016 9,348,791'N Ã— N connector for optical bundles of transmit / receive duplex pairs to implement supercomputer'2016 9,342,121'Cooling system for electronic components'2016 9,313,921'Chip stack structures that implement two-phase cooling with radial flow'2016 9,312,761'Three-D power converter in three distinct strata'2016 9,272,498'Precast thermal interface adhesive for easy and repeated, separation and remating'2016 9,213,378'Cooling system for electronic components'2015 9,207,002'Contaminant separator for a vapor-compression refrigeration apparatus'2015 9,171,742'Alignment of integrated circuit chip stack'2015 9,153,460'Heatsink attachment module'2015 9,111,925'Process for enhanced 3D integration and structures generated using the same'2015 9,093,446'Chip stack with electrically insulating walls'2015 9,093,445'Packaging identical chips in a stacked structure'2015 9,066,460'Disassemblable electronic assembly with leak-inhibiting coolant capillaries'2015 9,059,161'Composite wiring board with electrical through connections'2015 9,059,135'Nanochannel process and structure for bio-detection'2015 8,993,379'Chip stack with electrically insulating walls'2015 8,954,712'Computer system including an all-to-all communication network of processors connected using electrical and optical links'2015 8,937,810'Electronic assembly with detachable coolant manifold and coolant-cooled electronic module'2015 8,927,336'Packaging structure'2015 8,916,959'Packaging structure'2014 8,901,621'Nanochannel process and structure for bio-detection'2014 8,823,164'Heatsink attachment module'2014 8,772,927'Semiconductor package structures having liquid cooler integrated with first level chip package modules'2014 8,752,284'Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer'2014 8,713,955'Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus'2014 8,693,200'Semiconductor device cooling module'2014 8,600,202'Process for enhanced 3D integration and structures generated using the same'2013 8,569,874'High memory density, high input/output bandwidth logic-memory structure and architecture'2013 8,505,200'Land grid array interposer producing method'2013 8,505,617'Structure and apparatus for cooling integrated circuits using copper microchannels'2013 8,479,388'Method of producing a land grid array interposer'2013 8,476,753'Process for enhanced 3D integration and structures generated using the same'2013 8,418,751'Stacked and redundant chip coolers'2013 8,341,834'Method of producing a land grid array (LGA) interposer structure'2013 8,330,262'Processes for enhanced 3D integration and structures generated using the same'2012 8,316,540'Method of producing a land grid array (LGA) interposer structure'2012 8,268,389'Precast thermal interface adhesive for easy and repeated, separation and remating'2012 8,210,243'Structure and apparatus for cooling integrated circuits using cooper microchannels'2012 8,191,245'Method of forming a land grid array (LGA) interposer'2012 8,171,630'Method of producing a land grid array interposer'2012 8,136,242'Method of producing a land grid array interposer utilizing metal-on-elastomer'2012 8,115,303'Semiconductor package structures having liquid coolers integrated with first level chip package modules'2012 8,115,302'Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device'2012 8,081,473'Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages'2011 8,037,600'Method of producing a land grid array interposer structure'2011 8,011,563'Compliant mold fill head with integrated cavity venting and solder cooling'2011 8,002,477'Devices and methods for side-coupling optical fibers to optoelectronic components'2011 8,004,841'Method and apparatus of water cooling several parallel circuit cards each containing several chip packages'2011 7,990,711'Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate'2011 7,948,077'Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement'2011 7,928,562'Segmentation of a die stack for 3D packaging thermal management'2011 7,888,786'Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device'2011 7,863,070'Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale'2011 7,836,585'Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2010 7,832,095'Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2010 7,832,094'Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2010 7,823,283'Method of forming a land grid array interposer'2010 7,808,781'Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements'2010 7,803,664'Apparatus and methods for cooling semiconductor integrated circuit package structures'2010 7,768,121'Apparatus and methods for cooling semiconductor integrated circuit package structures'2010 7,665,999'Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane'2010 7,658,616'Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers'2010 7,641,479'Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material'2010 7,491,067'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2009 7,491,068'Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2009 7,488,182'Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane'2009 7,486,513'Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling'2009 7,484,966'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2009 7,473,102'Space transforming land grid array interposers'2009 7,468,766'Reflective spatial light modulator array including a light blocking layer'2008 7,467,951'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries'2008 7,462,039'LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases'2008 7,458,817'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,440,668'Devices and methods for side-coupling optical fibers to optoelectronic components'2008 7,402,052'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,394,659'Apparatus and methods for cooling semiconductor integrated circuit package structures'2008 7,381,063'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,377,790'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,374,428'Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,361,025'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,361,024'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,361,026'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,354,277'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,344,907'Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale'2008 7,342,789'Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling'2008 7,331,796'Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries'2008 7,288,839'Apparatus and methods for cooling semiconductor integrated circuit package structures'2007 7,284,992'Electronic package structures using land grid array interposers for module-to-board interconnection'2007 7,250,576'Chip package having chip extension and method'2007 7,230,334'Semiconductor integrated circuit chip packages having integrated microchannel cooling modules'2007 7,193,318'Multiple power density chip structure'2007 7,190,580'Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages'2007 7,180,179'Thermal interposer for thermal management of semiconductor devices'2007 7,139,172'Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages'2006 7,128,472'Method and apparatus for providing optoelectronic communication with an electronic device'2006 7,116,886'Devices and methods for side-coupling optical fibers to optoelectronic components'2006 7,079,393'Fluidic cooling systems and methods for electronic components'2006 7,001,498'Electroplating apparatus and four mask TFT array process with electroplated metal'2006 7,002,247'Thermal interposer for thermal management of semiconductor devices'2006 6,963,119'Integrated optical transducer assembly'2005 6,955,481'Method and apparatus for providing parallel optoelectronic communication with an electronic device'2005 6,879,098'Display fabrication using modular active devices'2005 6,874,950'Devices and methods for side-coupling optical fibers to optoelectronic components'2005 6,817,776'Method of bonding optical fibers and optical fiber assembly'2004 6,816,225'LCD cell construction by mechanical thinning of a color filter substrate'2004 6,815,270'Thin film transistor formed by an etching process with high anisotropy'2004 6,789,957'High-density optoelectronic transceiver assembly for optical communication data links'2004 6,791,639'Direct view display with lenticular lens for improved brightness and wide viewing angle'2004 6,781,650'Liquid crystal light valve and method for producing same, and liquid crystal projection display device'2004 6,774,482'Chip cooling'2004 6,752,539'Apparatus and system for providing optical bus interprocessor interconnection'2004 6,713,786'Thin film transistors with self-aligned transparent pixel electrode'2004 6,698,077'Display fabrication using modular active devices'2004 6,693,297'Thin film transistor formed by an etching process with high anisotropy'2004 6,648,485'Highly collimating tapered light guide for uniform illumination of flat panel displays'2003 6,620,719'Method of forming ohmic contacts using a self doping layer for thin-film transistors'2003 6,600,528'Integrated prism sheet for improved viewing angle in direct view color filterless liquid crystal displays'2003 6,529,189'Touch screen stylus with IR-coupled selection buttons'2003 6,525,342'Low resistance wiring in the periphery region of displays'2003 6,511,869'Thin film transistors with self-aligned transparent pixel electrode'2003 6,502,324'Method of alignment between sheet materials, method of alignment, substrate assembling method and aligning apparatus'2003 6,495,005'Electroplating apparatus'2002 6,483,498'Liquid crystal display with integrated resistive touch sensor'2002 6,429,058'Method of forming fully self-aligned TFT improved process window'2002 6,424,388'Reflective spatial light modulator array'2002 6,403,407'Method of forming fully self-aligned TFT with improved process window'2002 6,400,440'Passive liquid crystal display having pre-tilt control structure and light absorbent material at a center'2002 6,396,151'Partially-overlapped interconnect structure and method of making'2002 6,377,233'Micromechanical display and fabrication method'2002 6,346,175'Modification of in-plate refractory metal texture by use of refractory metal/nitride layer'2002 6,346,158'Alignment of lenticular sheets'2002 6,323,834'Micromechanical displays and fabrication method'2001 6,278,502'Pixel capacitor formed from multiple layers'2001 6,259,490'Liquid crystal display device'2001 6,256,080'Self-aligned structures for improved wide viewing angle for liquid crystal displays'2001 6,204,897'Integrated resistor for measuring touch position in a liquid crystal display device'2001 6,181,408'Tool and method for increasing liquid crystal fill rates of flat panel in which a sealed edge is compressed'2001 6,177,918'Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer'2001 6,110,819'Interconnect structure using Al.sub.2 Cu for an integrated circuit chip'2000 6,057,903'Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer'2000 5,925,933'Interconnect structure using Al.sub.2 -Cu for an integrated circuit chip'1999 5,912,506'Multi-layer metal sandwich with taper and reduced etch bias and method for forming same'1999 5,831,710'Liquid crystal display'1998 5,818,563'Substrate structure and assembly method for reduced spatial light modulator size'1998 5,764,314'Mechanical packaging and thermal management of flat mirror arrays'1998 5,721,602'Mechanical packaging and thermal management of flat mirror arrays'1998 5,706,067'Reflective spatial light modulator array'1998 5,639,316'Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal'1997 5,625,233'Thin film multi-layer oxygen diffusion barrier consisting of refractory metal, refractory metal aluminide, and aluminum oxide'1997 5,565,707'Interconnect structure using a Al.sub.2 Cu for an integrated circuit chip'1996 5,447,599'Self-aligned process for capping copper lines'1995 5,310,602'Self-aligned process for capping copper lines'1994 5,281,485'Structure and method of making Alpha-Ta in thin films'1994 5,277,985'Process for fabricating copper interconnects in ultra large scale integrated (ULSI) circuits'1994 5,221,449'Method of making Alpha-Ta thin films'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–2021Patents assigned to IBM (189)· patent assignee history

1994–2008Based in Suffern, NY, US· patent location history

1998–2019Based in Chestnut Ridge, NY, US· patent location history

2011–2016Patents assigned to COTEUS PAUL W (11)· patent assignee history

2011–2016Patents assigned to COLGAN EVAN GEORGE (8)· patent assignee history

2012–2015Patents assigned to COLGAN EVAN G (21)· patent assignee history

2012–2014Patents assigned to BEAMAN BRIAN S (8)· patent assignee history

2012–2019Based in Yorktown Heights, NY, US· patent location history

2012–2015Based in Armonk, NY, US· patent location history

2017–2021Based in Montvale, NJ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	189	1993–2021
COLGAN EVAN Gself	21	2012–2015
COTEUS PAUL W	11	2011–2016
BEAMAN BRIAN S	8	2012–2014
COLGAN EVAN GEORGEself	8	2011–2016

Locations

Location	Patents	Span
Chestnut Ridge, New York, US	141	1998–2019
Montvale, New Jersey, US	22	2017–2021
Suffern, New York, US	13	1994–2008
Yorktown Heights, New York, US	5	2012–2019
Armonk, New York, US	4	2012–2015