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Inventor

Hiroyuki Ezura

Inventor
Tokyo, JP

Overview

1→
Patents
2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering14%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling14%
B24BMachines, devices, or processes for grinding or polishing14%
B25JManipulators14%
B28DWorking stone or stone-like materials14%
C03BManufacture, shaping, or supplementary processes14%
C03CChemical composition of glasses, glazes or vitreous enamels14%
PatentTitleYear
11,090,767Curved plate machining apparatus, and method of manufacturing curved plate with machined outer circumference2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to AGC INC (1)· patent assignee history
2021Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
AGC INC12021
Locations
LocationPatentsSpan
Tokyo, JP12021