Inventor
ALEXANDER FLUEGEL
Inventor
DE
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
C07DHeterocyclic compounds7%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds7%
H01LSemiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C07CAcyclic or carbocyclic compounds3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
PatentTitleYear
12,559,852Composition for tin-silver alloy electroplating comprising a complexing agent202612,522,936Polyalkanolamines202612,509,790Composition for tin or tin alloy electroplating comprising leveling agent202512,134,834Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent202412,098,473Composition for cobalt plating comprising additive for void-free submicron feature filling202412,054,842Composition for tin-silver alloy electroplating comprising a complexing agent202411,926,918Composition for metal plating comprising suppressing agent for void free filing202411,840,771Composition for tin or tin alloy electroplating comprising suppressing agent202311,535,946Composition for tin or tin alloy electroplating comprising leveling agent202211,459,665Composition for tin or tin alloy electroplating comprising suppressing agent202211,387,108Composition for metal electroplating comprising leveling agent202211,377,748Composition for cobalt electroplating comprising leveling agent202211,242,606Composition for tin or tin alloy electroplating comprising suppressing agent2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to BASF SE (13)· patent assignee history
2022–2026Based in DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BASF SE | 13 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 13 | 2022–2026 |