Inventor
SHIH-WEI LIN
Inventor
TW
Overview
Patents· 31 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G02Bprimary
G02BOptical elements, systems or apparatus13%
B81BMicrostructural devices or systems, e.g. micromechanical devices8%
H01LSemiconductor devices8%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems7%
A61KPreparations for medical, dental or toiletry purposes4%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H01PWaveguides4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations3%
C12NMicroorganisms or enzymes3%
PatentTitleYear
12,496,321Anti-fatigue 202512,418,432Participant data synchronization in videoconferencing202512,391,545Semiconductor device and method for fabricating the same202512,345,920Semiconductor device and method of making202512,272,585Wafer chuck structure with holes in upper surface to improve temperature uniformity202512,265,262Source/drain feature separation structure202512,235,689Cable arrangement mechanism202512,183,764Channel pattern design to improve carrier transfer efficiency202412,136,679Semiconductor device comprising a photodetector with reduced dark current202412,043,537Method of manufacturing a microelectromechanical systems (MEMS) device202412,006,208Micro-electromechanical system device including a precision proof mass element and methods for forming the same202411,921,325Semiconductor device and method of making202411,904,917Anti-collision control method and rail vehicle control system202411,888,285Low numerical aperture fiber output diode laser module202411,787,056Robot arm obstacle avoidance method and robot arm obstacle avoidance system202311,766,465External composition for wound healing containing lactobacillus fermentation product and method for promoting wound healing using the same202311,752,177Method of reducing tobacco addiction in smoking subject with lactobacillus fermentum GKF3202311,749,762Semiconductor device comprising a photodetector with reduced dark current202311,740,412Structure including waveguide and isolation space202311,714,299Heater structure configured to improve thermal efficiency in a modulator device202311,693,295Auto-focusing device and method of fabricating the same202311,675,129Semiconductor device and method of making202311,634,320Micro-electromechanical system device including a precision proof mass element and methods for forming the same202311,434,129Semiconductor structure and method for fabricating the same202211,353,421Direct sensing BioFETs and methods of manufacture202211,256,114Semiconductor device and method of making202211,253,556None202211,226,506Heater structure with a gas-filled isolation structure to improve thermal efficiency in a modulator device202211,217,143Display device202211,209,673Heater structure configured to improve thermal efficiency in a modulator device202111,203,522Sidewall stopper for MEMS device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (21)· patent assignee history
2021–2025Based in TW· patent location history
2022–2025Patents assigned to GRAPE KING BIO LTD (4)· patent assignee history
2022Patents assigned to AU OPTRONICS CORP (1)· patent assignee history
2023Patents assigned to CHENG UEI PREC IND CO LTD (1)· patent assignee history
2023Based in CN· patent location history
2025Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 21 | 2021–2025 |
| GRAPE KING BIO LTD | 4 | 2022–2025 |
| AU OPTRONICS CORP | 1 | 2022 |
| CHENG UEI PREC IND CO LTD | 1 | 2023 |
| HEWLETT PACKARD DEVELOPMENT CO | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 30 | 2021–2025 |
| CN | 1 | 2023 |