Inventor
Cong Wei
Inventor
Poughkeepsie, NY, US
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing34%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
G01NInvestigating or analysing materials by determining their chemical or physical properties11%
Y10TTechnical subjects covered by former us classification6%
G06FElectric digital data processing4%
G01TMeasurement of nuclear or x-radiation2%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
G11BInformation storage based on relative movement between record carrier and transducer2%
H02JElectric power networks2%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
PatentTitleYear
10,580,096Method for determining integrated network loss rate in UHV AC cross-regional electricity trading202010,379,234Portable real time in-situ gamma-ray analysis system20197,779,310'System and method for detecting a work status of a computer system'20106,899,784'Apparatus for detecting CMP endpoint in acidic slurries'20056,878,629'Method for detecting CMP endpoint in acidic slurries'20056,506,341'Chemiluminescence detection apparatus'20036,440,263'Indirect endpoint detection by chemical reaction and chemiluminescence'20026,419,785'Endpoint detection by chemical reaction'20026,291,351'Endpoint detection in chemical-mechanical polishing of cloisonne structures'20016,276,987'Chemical mechanical polishing endpoint process control'20016,261,851'Optimization of CMP process by detecting of oxide/nitride interface using IR system'20016,254,453'Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system'20016,251,784'Real-time control of chemical-mechanical polishing processing by monitoring ionization current'20016,228,280'Endpoint detection by chemical reaction and reagent'20016,228,769'Endpoint detection by chemical reaction and photoionization'20016,194,230'Endpoint detection by chemical reaction and light scattering'20016,180,422'Endpoint detection by chemical reaction'20016,176,765'Accumulator for slurry sampling'20016,126,848'Indirect endpoint detection by chemical reaction and chemiluminescence'20006,066,564'Indirect endpoint detection by chemical reaction'20006,021,679'Probe for slurry gas sampling'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2005Patents assigned to IBM (17)· patent assignee history
2000–2005Based in Poughkeepsie, NY, US· patent location history
2003Patents assigned to ECO PHYSICS AG (1)· patent assignee history
2005Patents assigned to ECOPHYSICS AG (1)· patent assignee history
2010Patents assigned to HON HAI PREC IND CO LTD (1)· patent assignee history
2010Based in Taipei, TW· patent location history
2019Based in Rockville, MD, US· patent location history
2020Patents assigned to ECONOMIC & TECH RESEARCH INSTITUTE OF HUBEI ELECTRIC POWER COMPANY (1)· patent assignee history
2020Based in Hubei, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 17 | 2000–2005 |
| ECO PHYSICS AG | 1 | 2003 |
| ECONOMIC & TECH RESEARCH INSTITUTE OF HUBEI ELECTRIC POWER COMPANY | 1 | 2020 |
| ECOPHYSICS AG | 1 | 2005 |
| HON HAI PREC IND CO LTD | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 18 | 2000–2005 |
| Hubei, CN | 1 | 2020 |
| Rockville, Maryland, US | 1 | 2019 |
| Taipei, TW | 1 | 2010 |