Inventor
Stefan Wein
Inventor
Regensburg, DE
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,517,722'Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds'20097,276,783'Electronic component with a plastic package and method for production'20076,953,992'Electronic component with at least one semiconductor chip and method for its manufacture'20056,902,951'Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device'20056,867,471'Universal package for an electronic component with a semiconductor chip and method for producing the universal package'20056,710,455'Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component'20046,683,374'Electronic component and process for producing the electronic component'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2009Patents assigned to INFINEON TECHNOLOGIES AG (7)· patent assignee history
2004–2009Based in Regensburg, DE· patent location history
2005–2007Based in Lappersdorf, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 7 | 2004–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Regensburg, DE | 5 | 2004–2009 |
| Lappersdorf, DE | 2 | 2005–2007 |