Inventor
Ken Orui
Inventor
Kanagawa, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
Y10TTechnical subjects covered by former us classification31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
8,146,243'Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board'20127,421,777'Method of manufacturing multilayer wiring substrate using temporary metal support layer'20087,420,127'Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate'20087,288,724'Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate'20077,053,315'Junction structure and junction method for conductive projection'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2012Patents assigned to SONY CORP (5)· patent assignee history
2006Based in Kanagawaa, JP· patent location history
2007–2012Based in Kanagawa, JP· patent location history
2012Patents assigned to ASAMI HIROSHI (1)· patent assignee history
2012Patents assigned to HIWATASHI FUMITO (1)· patent assignee history
2012Patents assigned to KUSANO HIDETOSHI (1)· patent assignee history
2012Patents assigned to ORUI KEN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 5 | 2006–2012 |
| ASAMI HIROSHI | 1 | 2012 |
| HIWATASHI FUMITO | 1 | 2012 |
| KUSANO HIDETOSHI | 1 | 2012 |
| ORUI KENself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 4 | 2007–2012 |
| Kanagawaa, JP | 1 | 2006 |