Inventor
Yanqing Deng
Inventor
Shenchen, CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form9%
C03BManufacture, shaping, or supplementary processes9%
C03CChemical composition of glasses, glazes or vitreous enamels9%
C09KMaterials for miscellaneous applications, not provided for elsewhere9%
F21VFunctional features or details of lighting devices or systems thereof9%
G06FElectric digital data processing9%
H10DInorganic electric semiconductor devices9%
H10HInorganic light-emitting semiconductor devices having potential barriers9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
PatentTitleYear
11,053,161Glass fluorescent powder slice with multi-layer structure and preparation method therefor, and light-emitting device20219,418,982'Multi-layered integrated circuit with selective temperature coefficient of resistance'20168,392,867'System, method and program storage device for developing condensed netlists representative of groups of active devices in an integrated circuit and for modeling the performance of the integrated circuit based on the condensed netlists'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2016Patents assigned to IBM (2)· patent assignee history
2013Patents assigned to DENG YANQING (1)· patent assignee history
2013Patents assigned to HYDE PAUL A (1)· patent assignee history
2013Based in South Burlington, VT, US· patent location history
2016Based in North Potomac, MD, US· patent location history
2021Patents assigned to APPOTRONICS CHINA CORP (1)· patent assignee history
2021Patents assigned to APPOTRONICS CORP LTD (1)· patent assignee history
2021Based in Shenchen, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 2 | 2013–2016 |
| APPOTRONICS CHINA CORP | 1 | 2021 |
| APPOTRONICS CORP LTD | 1 | 2021 |
| DENG YANQINGself | 1 | 2013 |
| HYDE PAUL A | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shenchen, CN | 1 | 2021 |
| North Potomac, Maryland, US | 1 | 2016 |
| South Burlington, VT, US | 1 | 2013 |