Inventor
Viet Nguyen Hoang
Inventor
Leuven, BE
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Bprimary
H05BElectric heating19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
G01KMeasuring temperature5%
G01RMeasuring electric variables5%
B24BMachines, devices, or processes for grinding or polishing2%
C09KMaterials for miscellaneous applications, not provided for elsewhere2%
F21VFunctional features or details of lighting devices or systems thereof2%
PatentTitleYear
9,386,655'Light sensor device and manufacturing method'20169,081,251'Display device'20158,896,317'Lighting unit with compensation for output frequency, and method for determining output frequency'20148,772,073'Integrated circuit manufacturing method'20148,723,443'Method of controlling an LED, and an LED controller'20148,534,914'System and method for estimating the junction temperature of a light emitting diode'20138,471,565'System and method for output flux measurement of light emitting diode'20138,376,801'Luminescent component and manufacturing method'20138,368,877'Measuring apparatus'20138,367,552'Method for fabrication of in-laid metal interconnects'20138,368,105'Manufacturing method and integrated circuit having a light path to a pixilated element'20138,348,505'Self-calibration circuit and method for junction temperature estimation'20138,217,558'Apparatus for regulating the temperature of a light emitting diode'20128,174,041'Lighting unit with temperature compensation'20128,012,872'Planarising damascene structures'20117,985,673'Semiconductor device for low-power applications and a method of manufacturing thereof'20117,927,966'Method of manufacturing openings in a substrate, a via in substrate, and a semiconductor device comprising such a via'20117,709,387'Polishing apparatus and two-step method of polishing a metal layer of an integrated circuit'20107,491,639'Method of manufacturing a semiconductor device and semiconductor obtained by means of such a method'20097,025,662'Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2010Based in Delft, NL· patent location history
2009–2016Patents assigned to NXP BV (19)· patent assignee history
2009–2016Based in Leuven, BE· patent location history
2012–2016Patents assigned to NGUYEN HOANG VIET (14)· patent assignee history
2012–2016Patents assigned to SURDEANU RADU (13)· patent assignee history
2012–2016Patents assigned to BATAILLOU BENOIT (12)· patent assignee history
2012–2016Patents assigned to BANCKEN PASCAL (9)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP BV | 19 | 2009–2016 |
| NGUYEN HOANG VIETself | 14 | 2012–2016 |
| SURDEANU RADU | 13 | 2012–2016 |
| BATAILLOU BENOIT | 12 | 2012–2016 |
| BANCKEN PASCAL | 9 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Leuven, BE | 18 | 2009–2016 |
| Delft, NL | 2 | 2006–2010 |