Inventor
Roman Perez
Inventor
Singapore, SG
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
A61LMethods or apparatus for sterilising materials or objects in general13%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
Y02PClimate change mitigation technologies in the production or processing of goods13%
PatentTitleYear
10,322,210Preparation method of core-shell structured fibrous scaffolds20197,456,496'Package design and method of manufacture for chip grid array'20086,929,981'Package design and method of manufacture for chip grid array'20056,750,082'Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip'20046,734,039'Semiconductor chip grid array package design and method of manufacture'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2008Patents assigned to ADVANPACK SOLUTIONS PTE LTD (4)· patent assignee history
2004–2008Based in Singapore, SG· patent location history
2019Patents assigned to UNIV DANKOOK IACF (1)· patent assignee history
2019Based in Cheonan-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANPACK SOLUTIONS PTE LTD | 4 | 2004–2008 |
| UNIV DANKOOK IACF | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 4 | 2004–2008 |
| Cheonan-si, KR | 1 | 2019 |