Inventor
Enboa Wu
Inventor
Taipei, TW
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles7%
B60WConjoint control of vehicle sub-units of different type or different function7%
F21KNon-electric light sources using luminescence7%
F21VFunctional features or details of lighting devices or systems thereof7%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted7%
H05BElectric heating7%
Y02TClimate change mitigation technologies related to transportation7%
B60LPropulsion of electrically-propelled vehicles5%
G02BOptical elements, systems or apparatus5%
PatentTitleYear
9,027,679'Series-parallel coupling control method and system of hybrid power system'20158,716,644'Glare reduction apparatus'20148,672,512'Omni reflective optics for wide angle emission LED light bulb'20148,558,254'High reliability high voltage vertical LED arrays'20138,360,181'Hybrid vehicle and hybrid power system'20138,013,347'Remote control lighting assembly and use thereof'20117,943,052'Method for self-assembling microstructures'20117,844,375'Vehicle hybrid power system and method for creating simulated equivalent fuel consumption multidimensional data applicable thereto'20107,754,530'Thermal enhanced low profile package structure and method for fabricating the same'20107,511,365'Thermal enhanced low profile package structure'20097,482,632'LED assembly and use thereof'20097,474,287'Light emitting device'20097,351,609'Method for wafer level package of sensor chip'20087,271,020'Light emitting diode covered with a reflective layer and method for fabricating the same'20077,203,426'Optical subassembly of optical transceiver'20077,013,066'Tunable long period fiber grating structure and fabrication method'20066,459,150'Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer'20026,433,427'Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2015Patents assigned to IND TECH RES INST (8)· patent assignee history
2002–2014Based in Taipei, TW· patent location history
2006–2011Patents assigned to UNIV NAT TAIWAN (5)· patent assignee history
2009–2014Patents assigned to HK APPLIED SCIENCE & TECH RES (5)· patent assignee history
2009–2011Based in Irvine, CA, US· patent location history
2013–2015Patents assigned to WU E-IN (3)· patent assignee history
2013–2014Patents assigned to WU ENBOA (2)· patent assignee history
2013–2014Based in Hong Kong, CN· patent location history
2013Based in Yunlin County, TW· patent location history
2015Based in Zhonghe, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IND TECH RES INST | 8 | 2002–2015 |
| HK APPLIED SCIENCE & TECH RES | 5 | 2009–2014 |
| UNIV NAT TAIWAN | 5 | 2006–2011 |
| WU E-INself | 3 | 2013–2015 |
| WU ENBOAself | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 10 | 2002–2014 |
| Irvine, California, US | 3 | 2009–2011 |
| Hong Kong, CN | 2 | 2013–2014 |
| Zhonghe, TW | 1 | 2015 |
| Yunlin County, TW | 1 | 2013 |