Inventor
Shinsuke Watanabe
Inventor
Tokyo, JP
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Hprimary
H01HElectric switches10%
Y10TTechnical subjects covered by former us classification10%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
H01LSemiconductor devices7%
H03FAmplifiers7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
H10DInorganic electric semiconductor devices6%
B60NSeats specially adapted for vehicles4%
LOC134%
B22DCasting of metals3%
PatentTitleYear
10,854,523Semiconductor device2020D0885354Switch spring2020D0878311Switch spring202010,304,641Spring plate and push switch including spring plate201910,262,814Low travel switch assembly20199,999,919Method for operating continuous casting machine20189,887,284'Semiconductor device'20189,793,072'Push switch and switch module'20179,716,185'Field effect transistor'20179,691,762'Transistor for amplifying a high frequency signal'20179,672,998'Push switch'20179,409,229'Method for continuously casting slab'20169,412,533'Low travel switch assembly'20169,331,373'Directional coupler'20169,184,485'Directional coupler'20159,142,368'Push switch'20159,084,198'Wireless communication system and wireless communication apparatus, both for use in broadcast wireless transmission'20159,009,898'Mattress, pressure sensor calibration method, and bed device'20158,905,256'Resin-coated metal sheet'20148,809,709'Push switch'20148,728,866'Method for manufacturing semiconductor device'20148,653,888'High-frequency signal amplifier'20147,777,571'High frequency power amplifier'20107,714,664'Cascode circuit'20107,701,296'Semiconductor device'20107,691,483'Resin-coated metal sheet'20107,629,857'Second harmonic oscillator'2009D0605607'Illuminated switch'20097,435,465'Film-laminated metal sheet for container'20087,198,856'Film-laminated metal sheet for container'20077,000,768'Case for a press-through package'20066,869,121'Seat structure for vehicle'20056,853,388'Network management equipment and communication path setting method'20056,827,388'Seat arrangement structure for vehicle'20046,827,394'Vehicle seat system'20046,723,441'Resin film laminated metal sheet for can and method for fabricating the same'20046,317,699'Device and method for calibrating a robot'20015,549,785'Method of producing a semiconductor dynamic sensor'19965,223,086'Method of producing an acceleration sensor of a semiconductor'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2010Based in Fukuyama, JP· patent location history
2004–2005Based in Utsunomiya, JP· patent location history
2007–2014Patents assigned to JFE STEEL CORP (4)· patent assignee history
2009–2020Patents assigned to MITSUBISHI ELECTRIC CORP (12)· patent assignee history
2009–2020Patents assigned to CITIZEN ELECTRONICS (8)· patent assignee history
2009–2020Based in Tokyo, JP· patent location history
2009–2019Based in Fujiyoshida, JP· patent location history
2014–2017Patents assigned to CITIZEN HOLDINGS CO LTD (4)· patent assignee history
2014–2020Based in Yamanashi, JP· patent location history
2017–2020Patents assigned to CITIZEN WATCH CO LTD (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 12 | 2009–2020 |
| CITIZEN ELECTRONICS | 8 | 2009–2020 |
| CITIZEN WATCH CO LTD | 5 | 2017–2020 |
| CITIZEN HOLDINGS CO LTD | 4 | 2014–2017 |
| JFE STEEL CORP | 4 | 2007–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 15 | 2009–2020 |
| Yamanashi, JP | 7 | 2014–2020 |
| Fukuyama, JP | 4 | 2004–2010 |
| Fujiyoshida, JP | 3 | 2009–2019 |
| Utsunomiya, JP | 2 | 2004–2005 |