Inventor
Mark G. Courtney
Inventor
Poughkeepsie, NY, US
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
Y10TTechnical subjects covered by former us classification22%
H05KPrinted circuits17%
B23KSoldering or unsoldering16%
Y02PClimate change mitigation technologies in the production or processing of goods16%
G01RMeasuring electric variables2%
PatentTitleYear
6,858,111'Conductive polymer interconnection configurations'20056,552,529'Method and apparatus for interim assembly electrical testing of circuit boards'20036,333,563'Electrical interconnection package and method thereof'20016,333,104'Conductive polymer interconnection configurations'20016,283,359'Method for enhancing fatigue life of ball grid arrays'20016,278,184'Solder disc connection'20016,253,986'Solder disc connection'20016,158,644'Method for enhancing fatigue life of ball grid arrays'20006,070,321'Solder disc connection'20005,975,409'Ceramic ball grid array using in-situ solder stretch'19995,968,670'Enhanced ceramic ball grid array using in-situ solder stretch with spring'19995,964,396'Enhanced ceramic ball grid array using in-situ solder stretch with clip'19995,881,944'Multi-layer solder seal band for semiconductor substrates'19995,881,945'Multi-layer solder seal band for semiconductor substrates and process'19995,819,402'Method for cooling of chips using blind holes with customized depth'19985,757,620'Apparatus for cooling of chips using blind holes with customized depth'19985,724,729'Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials'19985,623,394'Apparatus for cooling of chips using a plurality of customized thermally conductive materials'19975,604,978'Method for cooling of chips using a plurality of materials'19974,715,430'Environmentally secure and thermally efficient heat sink assembly'1987Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1987–2005Patents assigned to IBM (20)· patent assignee history
1987–2005Based in Poughkeepsie, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 20 | 1987–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Poughkeepsie, New York, US | 20 | 1987–2005 |