Inventor
EIJI KUROSE
Inventor
JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1032%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
12,469,709Semiconductor package electrical contact structures and related methods202512,444,609Silicon-on-insulator die support structures and related methods202512,431,359Semiconductor package electrical contacts and related methods202512,374,555Die sidewall coatings and related methods202512,374,554Semiconductor packages with die including cavities and related methods202512,341,014Multi-faced molded semiconductor package and related methods202512,230,502Semiconductor package stress balance structures and related methods202512,040,310Methods of forming semiconductor packages with back side metal202412,040,192Die sidewall coatings and related methods202411,908,699Semiconductor packages with die including cavities202411,901,184Backmetal removal methods202411,894,234Semiconductor packages with die support structure for thin die202411,791,297Molded semiconductor package and related methods202311,562,981Methods of forming semiconductor packages with back side metal202311,404,277Die sidewall coatings and related methods202211,404,276Semiconductor packages with thin die and related methods202211,393,692Semiconductor package electrical contact structures and related methods202211,367,619Semiconductor package electrical contacts and related methods202211,361,970Silicon-on-insulator die support structures and related methods202211,348,796Backmetal removal methods202211,342,189Semiconductor packages with die including cavities and related methods202211,328,930Multi-faced molded semiconductor package and related methods202211,244,918Molded semiconductor package and related methods2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (23)· patent assignee history
2022–2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMICONDUCTOR COMPONENTS IND LLC | 23 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 23 | 2022–2025 |