Inventor
Pulkit Agarwal
Inventor
Beaverton, OR, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H01LSemiconductor devices24%
C23CCoating metallic material13%
H01JElectric discharge tubes or discharge lamps11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
B08BCleaning in general2%
B24CAbrasive or related blasting with particulate material2%
B25JManipulators2%
G06FElectric digital data processing2%
PatentTitleYear
10,847,352Compensating chamber and process effects to improve critical dimension variation for trim process202010,801,109Method and apparatus for providing station to station uniformity202010,727,143Method for controlling core critical dimension variation using flash trim sequence202010,658,172Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer202010,655,224Conical wafer centering and holding device for semiconductor processing202010,579,371Recommendations for custom software upgrade by cognitive technologies202010,494,715Atomic layer clean for removal of photoresist patterning scum201910,431,451Methods and apparatuses for increasing reactor processing batch size201910,431,489Substrate support apparatus having reduced substrate particle generation201910,269,559Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer20199,997,371Atomic layer etch methods and hardware for patterning applications20189,947,578Methods for forming low-resistance contacts through integrated process flow systems20189,925,639'Cleaning of chamber components with solid carbon dioxide particles'20189,536,329'Method and apparatus for performing sentiment analysis based on user reactions to displayable content'20179,425,076'Substrate transfer robot end effector'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2019Patents assigned to APPLIED MATERIALS INC (4)· patent assignee history
2017Patents assigned to ADOBE SYSTEMS INC (1)· patent assignee history
2017Based in Lucknow, IN· patent location history
2018–2020Patents assigned to LAM RES CORP (9)· patent assignee history
2018–2020Based in Beaverton, OR, US· patent location history
2018–2019Based in Santa Clara, CA, US· patent location history
2020Patents assigned to IBM (1)· patent assignee history
2020Based in Hillsboro, OR, US· patent location history
2020Based in Banaswadi, IN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 9 | 2018–2020 |
| APPLIED MATERIALS INC | 4 | 2016–2019 |
| ADOBE SYSTEMS INC | 1 | 2017 |
| IBM | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beaverton, OR, US | 8 | 2018–2020 |
| Santa Clara, California, US | 3 | 2018–2019 |
| Hillsboro, OR, US | 1 | 2020 |
| Banaswadi, IN | 1 | 2020 |
| Lucknow, IN | 1 | 2017 |