Inventor
MASATO ARAKI
Inventor
JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material28%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H03HImpedance networks, e.g. resonant circuits17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
H01LSemiconductor devices6%
PatentTitleYear
12,416,075Film-forming method and film-forming system202512,344,930Deposition method and deposition apparatus202511,993,841Substrate processing method and substrate processing apparatus202411,984,319Substrate processing method and film forming system202411,811,387Elastic wave device202311,702,734Method for forming ruthenium film and apparatus for forming ruthenium film202311,405,021Filter device and multiplexer202211,211,914Acoustic wave device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2023Patents assigned to MURATA MANUFACTURING CO (3)· patent assignee history
2021–2025Based in JP· patent location history
2022Patents assigned to MURATA MFG CO LTD 452644 (1)· patent assignee history
2023–2025Patents assigned to TOKYO ELECTRON LTD (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 5 | 2023–2025 |
| MURATA MANUFACTURING CO | 3 | 2021–2023 |
| MURATA MFG CO LTD 452644 | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 8 | 2021–2025 |