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Inventor

Shun Ming Fung

Inventor
Kwai Chung, HK

Overview

4→
Patents
2010–2019
Patent span
Physics
Primary field (CPC G)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Bprimary
G01BMeasuring length, thickness or similar linear dimensions33%
G05BControl or regulating systems in general17%
G06TImage data processing or generation, in general17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
PatentTitleYear
10,311,597Apparatus and method of determining a bonding position of a die20198,804,136'Apparatus and method for locating a plurality of placement positions on a carrier object'20147,810,698'Vision system for positioning a bonding tool'20107,676,114'Imaging system for three-dimensional reconstruction of surface profiles'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010Patents assigned to ASM ASSEMBLY AUTOMATION LTD (2)· patent assignee history
2010–2014Based in Kwai Chung, HK· patent location history
2014–2019Patents assigned to ASM TECH SINGAPORE PTE LTD (2)· patent assignee history
2014Patents assigned to CHAN WENLING (1)· patent assignee history
2014Patents assigned to FUNG SHUN MING (1)· patent assignee history
2014Patents assigned to LAM KUI KAM (1)· patent assignee history
2019Based in Hong Kong, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASM ASSEMBLY AUTOMATION LTD22010
ASM TECH SINGAPORE PTE LTD22014–2019
CHAN WENLING12014
FUNG SHUN MINGself12014
LAM KUI KAM12014
Locations
LocationPatentsSpan
Kwai Chung, HK32010–2014
Hong Kong, CN12019