Inventor
YEJIN PARK
Inventor
KR
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01QAntennas, i.e. radio aerials8%
H05KPrinted circuits8%
H10BElectronic memory devices8%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
12,593,397Electronic package and method for making the same202612,588,496Semiconductor device and data storage system including the same202612,564,060Method for forming a partial shielding for an electronic assembly202612,444,718Semiconductor device and method of forming compartment shielding for a semiconductor package2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to JCET STATS CHIPPAC KOREA LTD (3)· patent assignee history
2025–2026Based in KR· patent location history
2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JCET STATS CHIPPAC KOREA LTD | 3 | 2025–2026 |
| SAMSUNG ELECTRONICS CO LTD | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 4 | 2025–2026 |