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Inventor

XINYUAN CAI

Inventor
CN

Overview

2→
Patents
2023–2024
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Gprimary
C09GPolishing compositions25%
C23FNon-mechanical removal of metallic material from surface25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
12,098,299Chemical mechanical polishing slurry and use thereof202411,746,257Chemical mechanical polishing solution2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to ANJI MICROELECTRONICS SHANGHAI CO LTD (2)· patent assignee history
2023–2024Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ANJI MICROELECTRONICS SHANGHAI CO LTD22023–2024
Locations
LocationPatentsSpan
CN22023–2024