Inventor
TETSURO SATO
Inventor
JP
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits13%
H01LSemiconductor devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08LCompositions of macromolecular compounds5%
G06FElectric digital data processing5%
H01GCapacitors5%
A63FCard, board, or roulette games4%
PatentTitleYear
12,377,887Fire-resistant floor structure of railroad vehicle202512,351,698Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor202512,139,592Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor element202411,959,775Information processing device and information processing method that enable simple calibration202411,947,119Display control device, display control method, and recording medium202411,935,865Semiconductor package manufacturing method, and adhesive sheet used therein202411,890,853Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor202411,876,070Semiconductor package manufacturing method202411,525,073Multilayer circuit board manufacturing method202211,527,415Multilayer circuit board manufacturing method202211,458,400Information processing device, information processing method, and program for generating an added related to a predicted future behavior202211,419,210Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to MITSUI MINING & SMELTING CO LTD (8)· patent assignee history
2022Patents assigned to SONY CORP (1)· patent assignee history
2022–2025Based in JP· patent location history
2024Patents assigned to SONY GROUP CORP (2)· patent assignee history
2025Patents assigned to NIPPON SHARYO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUI MINING & SMELTING CO LTD | 8 | 2022–2025 |
| SONY GROUP CORP | 2 | 2024 |
| NIPPON SHARYO LTD | 1 | 2025 |
| SONY CORP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 12 | 2022–2025 |