Inventor

Shih-Chang Lee

Inventor

Hsinchu, TW

Overview

2001–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 60 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%

H01LSemiconductor devices19%

H10HInorganic light-emitting semiconductor devices having potential barriers17%

H05KPrinted circuits8%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

Y02PClimate change mitigation technologies in the production or processing of goods3%

Y10TTechnical subjects covered by former us classification3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

B29CShaping or joining of plastics2%

PatentTitleYear

D0894850Light-emitting device2020 10,756,134Light-emitting device2020 10,741,721Light-emitting device and manufacturing method thereof2020 10,727,231Heterogeneously integrated semiconductor device and manufacturing method thereof2020 10,461,223Semiconductor device2019 10,453,995Light-emitting device and manufacturing method thereof2019 10,447,060Charging device and charging system2019 10,312,407Light-emitting device and manufacturing method thereof2019 10,217,892Tandem solar cell2019 10,156,335Light-emitting device2018 10,134,735Heterogeneously integrated semiconductor device and manufacturing method thereof2018 10,121,933Semiconductor device and the manufacturing method thereof2018 10,084,115Optoelectronic device and the manufacturing method thereof2018 10,032,954Light-emitting device and manufacturing method thereof2018 9,847,450Light-emitting device and manufacturing method thereof2017 9,768,351'Optoelectronic semiconductor device with barrier layer'2017 9,640,728'Optoelectronic device and the manufacturing method thereof'2017 9,609,786'Cooling system for an electronic rack'2017 9,525,101'Optoelectronic device'2016 9,444,019'Method for reusing a substrate for making light-emitting device'2016 9,331,239'Light-emitting device'2016 9,269,863'Light-emitting apparatus'2016 9,153,944'Light-emitting array'2015 9,048,376'Solar cell devices and apparatus comprising the same'2015 9,035,280'Light-emitting device'2015 8,879,268'Cooling system for an electronic rack'2014 8,829,486'Light-emitting device having active layers stacked alternately'2014 8,755,665'Electromagnetic wave gathering device and solar cell module having the same'2014 8,720,053'Process of fabricating a circuit board'2014 8,653,499'Light-emitting diode with strain-relaxed layer for reducing strain in active layer'2014 8,644,234'Wireless device for selecting connection target based on signal quality, system and method thereof'2014 8,179,222'Transformer with conductive plate winding structure'2012 8,159,845'Current-sharing power supply apparatus'2012 8,064,228'Power supply apparatus with current-sharing function'2011 7,944,152'Two-stage balancer for multi-lamp backlight'2011 7,605,020'Semiconductor chip package'2009 7,439,619'Electronic package structure and the packaging process thereof'2008 7,375,020'Method of forming bumps'2008 7,195,956'Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units'2007 7,193,282'Contact sensor package'2007 7,187,070'Stacked package module'2007 7,151,308'Semiconductor chip package'2006 7,126,221'Semiconductor package'2006 7,122,757'Contact sensor package structure'2006 7,061,079'Chip package structure and manufacturing method thereof'2006 7,019,407'Flip chip package structure'2006 7,015,571'Multi-chips module assembly package'2006 7,002,805'Thermal enhance MCM package and manufacturing method thereof'2006 6,916,732'Method of forming bumps'2005 6,815,833'Flip chip package'2004 6,724,075'Semiconductor chip package and manufacturing method thereof'2004 6,624,004'Flip chip interconnected structure and a fabrication method thereof'2003 6,610,924'Semiconductor package'2003 6,524,886'Method of making leadless semiconductor package'2003 6,482,675'Substrate strip for use in packaging semiconductor chips and method for making the substrate strip'2002 6,465,277'Molding apparatus and molding method for flexible substrate based package'2002 6,380,002'Method for fabricating a flexible substrate based ball grid array (BGA) package'2002 6,262,490'Substrate strip for use in packaging semiconductor chips'2001 6,257,857'Molding apparatus for flexible substrate based package'2001 6,242,815'Flexible substrate based ball grid array (BGA) package'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2014Patents assigned to ADVANCED SEMICONDUCTOR ENG (26)· patent assignee history

2001–2014Based in Kaohsiung, TW· patent location history

2007Based in Dashe Township, TW· patent location history

2011–2015Patents assigned to LEE SHIH-CHANG (9)· patent assignee history

2011–2019Patents assigned to CHICONY POWER TECH CO LTD (5)· patent assignee history

2011–2012Patents assigned to LEE CHUNG-SHU (3)· patent assignee history

2011–2017Based in Taipei, TW· patent location history

2014–2020Patents assigned to EPISTAR CORP (26)· patent assignee history

2014–2020Based in Hsinchu, TW· patent location history

2014–2019Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ADVANCED SEMICONDUCTOR ENG	26	2001–2014
EPISTAR CORP	26	2014–2020
LEE SHIH-CHANGself	9	2011–2015
CHICONY POWER TECH CO LTD	5	2011–2019
LEE CHUNG-SHU	3	2011–2012

Locations

Location	Patents	Span
Hsinchu, TW	26	2014–2020
Kaohsiung, TW	25	2001–2014
Taipei, TW	6	2011–2017
New Taipei, TW	2	2014–2019
Dashe Township, TW	1	2007