Inventor
MAOLIN LONG
Inventor
US
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Jprimary
H01JElectric discharge tubes or discharge lamps38%
H01LSemiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H05HPlasma technique10%
H03FAmplifiers8%
H03KPulse technique5%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems2%
H03HImpedance networks, e.g. resonant circuits2%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications2%
B08BCleaning in general1%
PatentTitleYear
12,580,157Grid assembly for plasma processing apparatus202612,507,338Matchless plasma source for semiconductor wafer fabrication202512,490,370Matchless plasma source for semiconductor wafer fabrication202512,484,139Matchless plasma source for semiconductor wafer fabrication202512,476,077Induction coil assembly for plasma processing apparatus202512,471,202Matchless plasma source for semiconductor wafer fabrication202512,437,966Systems and methods for reverse pulsing202512,424,410RF pulsing within pulsing for semiconductor RF plasma processing202512,417,900Plasma processing apparatus202512,400,831Dual frequency matching circuit for inductively coupled plasma (ICP) loads202512,347,661Pressure control system for a multi-head processing chamber of a plasma processing apparatus202512,340,981Workpiece processing apparatus with outer gas channel insert202512,334,312Configurable faraday shield202512,322,579Metal contamination reduction in substrate processing systems with transformer coupled plasma202512,283,467Plasma strip tool with movable insert202512,283,463Systems and methods for multi-level pulsing in RF plasma tools202512,266,503Hybrid plasma source array202512,261,029Protection system for switches in direct drive circuits of substrate processing systems202512,261,073Electrostatic chuck assembly for plasma processing apparatus202512,193,138Matchless plasma source for semiconductor wafer fabrication202512,165,841Dual-frequency, direct-drive inductively coupled plasma source202412,159,770Cooled shield for ICP source202412,119,254Electrostatic chuck assembly for plasma processing apparatus202412,106,947RF reference measuring circuit for a direct drive system supplying power to generate plasma in a substrate processing system202412,040,159Dual frequency matching circuit for inductively coupled plasma (ICP) loads202412,009,184Lift pin assembly for a plasma processing apparatus202412,002,701Electrostatic chuck assembly for plasma processing apparatus202411,837,493Electrostatic chuck assembly for plasma processing apparatus202311,798,785Systems for reverse pulsing202311,728,137Direct frequency tuning for matchless plasma source in substrate processing systems202311,728,136RF pulsing within pulsing for semiconductor RF plasma processing202311,716,805Matchless plasma source for semiconductor wafer fabrication202311,437,219Frequency tuning for a matchless plasma source202211,342,159RF pulsing within pulsing for semiconductor RF plasma processing202211,224,116Matchless plasma source for semiconductor wafer fabrication2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to LAM RES CORP (19)· patent assignee history
2022–2026Based in US· patent location history
2023–2026Patents assigned to BEIJING E TOWN SEMICONDUCTOR TECH CO LTD (16)· patent assignee history
2023–2026Patents assigned to MATTSON TECH INC (16)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 19 | 2022–2025 |
| BEIJING E TOWN SEMICONDUCTOR TECH CO LTD | 16 | 2023–2026 |
| MATTSON TECH INC | 16 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 35 | 2022–2026 |