Inventor

Takaaki Higashida

Inventor
Kadoma, JP

Overview

27→
Patents
1999–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics14%
H10NElectric solid-state devices not otherwise provided for12%
H01LSemiconductor devices11%
H05KPrinted circuits11%
B29DProducing particular articles from plastics or from substances in a plastic state7%
B41FPrinting machines or presses7%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B29LIndexing scheme associated with subclass b29c, relating to particular articles5%
G11BInformation storage based on relative movement between record carrier and transducer4%
PatentTitleYear
10,032,974Thermoelectric conversion module and thermoelectric conversion apparatus20189,496,476'Thermoelectric conversion module'20169,219,216'Thermoelectric conversion element, thermoelectric conversion element module, and method of manufacturing the same'20159,219,214'Thermoelectric conversion element and producing method thereof'20159,087,963'Apparatus for manufacturing thermoelectric conversion element'20159,024,173'Thermoelectric conversion element module and method of manufacturing the same'20158,742,246'Thermoelectric conversion module and method of manufacturing thereof'20148,530,922'Organic EL device and method for manufacturing same'20138,414,960'Ink composition for organic electroluminescent device and production method thereof'20138,237,359'Display apparatus'20127,214,887'Electronic circuit connecting structure, and its connecting method'20077,084,512'Circuit substrate and its manufacturing method'20067,036,221'Method of manufacturing a semiconductor element-mounting board'20066,875,378'Optical disk molding apparatus and method'20056,835,270'Process and apparatus of producing optical disk and process of producing substrate'20046,814,804'Apparatus and method for printing solder paste'20046,762,107'Capacitor and manufacturing method thereof'20046,514,437'Stamper protecting layer for optical disk molding apparatus, optical disk molding apparatus and optical disk molding method using the stamper protecting layer'20036,461,142'Injection device'20026,453,811'Printing method and printing apparatus'20026,416,609'Process and apparatus of producing optical disk and process of producing substrate'20026,395,335'Apparatus and method for printing solder paste'20026,265,673'Semiconductor element-mounting board and semiconductor device'20016,135,024'Screen printing method and printing apparatus'20006,099,287'Stamper protecting layer for optical disk molding apparatus'20005,961,898'Molding apparatus and molding method for light-permeable articles'19995,868,978'Injection molding method for thin components'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2007Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (17)· patent assignee history
1999–2006Based in Kadoma, JP· patent location history
2007–2018Based in Osaka, JP· patent location history
2012–2015Patents assigned to HIGASHIDA TAKAAKI (8)· patent assignee history
2012–2018Patents assigned to PANASONIC CORP (5)· patent assignee history
2014–2015Patents assigned to KUBO TAKASHI (5)· patent assignee history
2015–2018Patents assigned to PANASONIC IP MAN CO LTD (6)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD171999–2007
HIGASHIDA TAKAAKIself82012–2015
PANASONIC IP MAN CO LTD62015–2018
KUBO TAKASHI52014–2015
PANASONIC CORP52012–2018
Locations
LocationPatentsSpan
Kadoma, JP161999–2006
Osaka, JP112007–2018