Inventor
Yuan-Feng Chiang
Inventor
Kaohsiung, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
C23CCoating metallic material8%
G02BOptical elements, systems or apparatus8%
PatentTitleYear
10,663,746Collimator, optical device and method of manufacturing the same202010,344,383Semiconductor package device and method of manufacturing the same201910,325,854Interposer and semiconductor package device201910,211,161Semiconductor package structure having a protection layer20199,947,635Semiconductor package, interposer and semiconductor process for manufacturing the same20189,929,078'Semiconductor package structure and method for manufacturing the same'2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2020Patents assigned to ADVANCED SEMICONDUCTOR ENG (6)· patent assignee history
2018–2020Based in Kaohsiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 6 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 6 | 2018–2020 |