Inventor
CHIA-WEI WANG
Inventor
TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
A61KPreparations for medical, dental or toiletry purposes6%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations6%
C07KPeptides6%
C12NMicroorganisms or enzymes6%
G06FElectric digital data processing6%
G11CStatic stores4%
H01GCapacitors2%
PatentTitleYear
12,536,273Electronic system and security authority delegation method thereof202612,525,878Shared pump structure that can dynamically adjust its phase ratio and control method thereof202612,511,381Event reporting method, security management circuit, and management system202512,469,757Package structure including a die having a taper-shaped die connector202512,429,980Method for detecting damages of touch display panel202512,176,321Semiconductor packages and method of forming the same202412,148,732Package structure and method of fabrcating the same202412,132,023Integrated circuit, package structure, and manufacturing method of package structure202412,071,456Extended recombinant polypeptides and compositions comprising same202411,990,383Package structure having at least one die with a plurality of taper-shaped die connectors202411,981,744Chimeric polypeptide assembly and methods of making and using the same202411,713,358Chimeric polypeptide assembly and methods of making and using the same202311,539,070Method for manufacture and structure of multiple electrochemistries and energy gathering components within a unified structure202211,515,276Integrated circuit, package structure, and manufacturing method of package structure202211,508,633Package structure having taper-shaped conductive pillar and method of forming thereof202211,450,641Method of fabricating package structure202211,222,691Double-pitch-layout techniques and apparatus thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (8)· patent assignee history
2022Patents assigned to MEDIATEK INC (1)· patent assignee history
2022–2026Based in TW· patent location history
2022–2024Based in US· patent location history
2023–2024Patents assigned to AMUNIX PHARMACEUTICALS INC (3)· patent assignee history
2025–2026Patents assigned to ASPEED TECHNOLOGY INC (2)· patent assignee history
2025–2026Patents assigned to NOVATEK MICROELECTRONICS CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 8 | 2022–2025 |
| AMUNIX PHARMACEUTICALS INC | 3 | 2023–2024 |
| ASPEED TECHNOLOGY INC | 2 | 2025–2026 |
| NOVATEK MICROELECTRONICS CORP | 2 | 2025–2026 |
| MEDIATEK INC | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 13 | 2022–2026 |
| US | 4 | 2022–2024 |