Inventor
Shuji Manda
Inventor
Kanagawa, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation25%
H01LSemiconductor devices23%
H04NPictorial communication, e.g. television13%
H10KOrganic electric solid-state devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y02PClimate change mitigation technologies in the production or processing of goods8%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
H10DInorganic electric semiconductor devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
PatentTitleYear
11,049,906Imaging device, manufacturing device, and manufacturing method202110,991,745Semiconductor device, method of manufacturing the same, and electronic apparatus202110,950,644Image pickup element, method of manufacturing image pickup element, and electronic apparatus202110,943,932Light-receiving element, method of manufacturing light-receiving element, imaging device, and electronic apparatus202110,903,279Solid state image sensor pixel electrode below a photoelectric conversion film202110,840,398Photoelectric conversion element, method for manufacturing same, and imaging apparatus202010,615,298Photoelectric conversion element, method for manufacturing same, and imaging apparatus202010,580,831Imaging device, manufacturing device, and manufacturing method202010,483,299Light-receiving element, method of manufacturing light-receiving element, imaging device, and electronic apparatus201910,461,110Image pickup element, method of manufacturing image pickup element, and electronic apparatus201910,453,898Solid state image sensor pixel electrode below a photoelectronic conversion film201910,332,921Solid-state image sensing device and method for manufacturing the same, and electronic device201910,074,696Imaging device, manufacturing device, and manufacturing method20189,893,105'Image pickup element, method of manufacturing image pickup element, and electronic apparatus'20189,502,454'Image pickup element, method of manufacturing image pickup element, and electronic apparatus'20169,337,226'Image pickup element, method of manufacturing image pickup element, and electronic apparatus'20169,281,327'Image sensor, imaging apparatus, and apparatus and method for manufacturing image sensor'20168,878,263'Semiconductor device, method for manufacturing same, and solid-state image sensing device'20148,212,296'Semiconductor device and a method of manufacturing the same, and solid-state image pickup element'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2021Patents assigned to SONY CORP (10)· patent assignee history
2012–2014Patents assigned to MANDA SHUJI (2)· patent assignee history
2012Patents assigned to TAKAHASHI HIROSHI (1)· patent assignee history
2012–2021Based in Kumamoto, JP· patent location history
2018–2021Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (9)· patent assignee history
2018–2021Based in Kanagawa, JP· patent location history
2021Patents assigned to SONY SEMINCONDUCTOR SOLUTIONS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 10 | 2012–2021 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 9 | 2018–2021 |
| MANDA SHUJIself | 2 | 2012–2014 |
| SONY SEMINCONDUCTOR SOLUTIONS CORP | 1 | 2021 |
| TAKAHASHI HIROSHI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 11 | 2018–2021 |
| Kumamoto, JP | 8 | 2012–2021 |