LexDanaLexDanabeta
Inventor

Shu E Ku

Inventor
Miado, TW

Overview

3→
Patents
2003–2005
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
C23CCoating metallic material29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests14%
PatentTitleYear
6,884,659'Thin interface layer to improve copper etch stop'20056,756,321'Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant'20046,623,654'Thin interface layer to improve copper etch stop'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2005Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2003Based in Miadi, TW· patent location history
2004Based in Miaoli, TW· patent location history
2005Based in Miado, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG32003–2005
Locations
LocationPatentsSpan
Miado, TW12005
Miaoli, TW12004
Miadi, TW12003