Inventor
Tianji ZHOU
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10BElectronic memory devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10NElectric solid-state devices not otherwise provided for17%
G11CStatic stores7%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
PatentTitleYear
12,414,480MRAM bottom electrode contact with taper profile202511,944,013Magnetic tunnel junction device with minimum stray field202411,876,047Decoupled interconnect structures202411,621,294Embedding MRAM device in advanced interconnects202311,361,987Forming decoupled interconnects202211,251,368Interconnect structures with selective capping layer202211,244,907Metal surface preparation for increased alignment contrast202211,239,160E-fuse with dielectric zipping202211,227,997Planar resistive random-access memory (RRAM) device with a shared top electrode202211,177,213Embedded small via anti-fuse device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to IBM (10)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2021–2025 |