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Inventor

Toshio Ogasawara

Inventor
Tokyo, JP

Overview

9→
Patents
1989–2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 9 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Dprimary
C09DCoating compositions, e.g. paints, varnishes or lacquers18%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds15%
C08JWorking-up13%
C08LCompositions of macromolecular compounds13%
B29CShaping or joining of plastics5%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%
B29LIndexing scheme associated with subclass b29c, relating to particular articles5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
B05DProcesses for applying fluent materials to surfaces, in general3%
C04BLime, magnesia3%
PatentTitleYear
10,815,390Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof202010,597,333Process for producing ceramic fiber-reinforced composite material202010,047,246Varnish including 2-phenyl-4,4'-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strength201810,017,666Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof20189,051,430'Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance'20158,846,552'Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance'20145,945,487'Thermosetting powder coating composition'19995,177,333'High frequency cooking device having electromagnetic induction heater'19934,840,715'Electrodeposition coating method'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1999Patents assigned to KANSAI PAINT CO LTD (2)· patent assignee history
1989Based in Kamakura, JP· patent location history
1993Based in Saitama, JP· patent location history
1999Based in Hiratsuka, JP· patent location history
2014–2020Patents assigned to KANEKA CORP (5)· patent assignee history
2014–2015Patents assigned to ISHIDA YUICHI (2)· patent assignee history
2014–2015Patents assigned to MIYAUCHI MASAHIKO (2)· patent assignee history
2014–2020Based in Chofu, JP· patent location history
2015–2020Patents assigned to JAPAN AEROSPACE EXPLORATION (5)· patent assignee history
2018–2020Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
JAPAN AEROSPACE EXPLORATION52015–2020
KANEKA CORP52014–2020
ISHIDA YUICHI22014–2015
KANSAI PAINT CO LTD21989–1999
MIYAUCHI MASAHIKO22014–2015
Locations
LocationPatentsSpan
Tokyo, JP32018–2020
Chofu, JP32014–2020
Hiratsuka, JP11999
Saitama, JP11993
Kamakura, JP11989